WIRING SUBSTRATE, MANUFACTURING METHOD THEREOF, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF
First Claim
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1. A wiring substrate comprising:
- an insulating resin layer provided on both surfaces of a sheet-like fibrous body, the sheet-like fibrous body impregnated with the insulating resin layer; and
a wiring surrounded by the insulating resin layer, the wiring comprising a conductive material, the wiring penetrating the sheet-like fibrous body,wherein a portion of the sheet-like fibrous body is positioned in the wiring,wherein the wiring is exposed on both surfaces of the insulating resin layer, andwherein the sheet-like fibrous body is impregnated with the conductive material.
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Abstract
A wiring substrate is provided, including an insulating resin layer which is provided on both surfaces of a sheet-like fibrous body and with which the sheet-like fibrous body is impregnated, and a through wiring provided in a region surrounded by the insulating resin layer. The through wiring is formed using a conductive material, the conductive material is exposed on both surfaces of the insulating resin layer, the sheet-like fibrous body is positioned in the conductive material, and the sheet-like fibrous body is impregnated with the conductive material. A manufacturing method of the wiring substrate is also provided.
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Citations
4 Claims
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1. A wiring substrate comprising:
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an insulating resin layer provided on both surfaces of a sheet-like fibrous body, the sheet-like fibrous body impregnated with the insulating resin layer; and a wiring surrounded by the insulating resin layer, the wiring comprising a conductive material, the wiring penetrating the sheet-like fibrous body, wherein a portion of the sheet-like fibrous body is positioned in the wiring, wherein the wiring is exposed on both surfaces of the insulating resin layer, and wherein the sheet-like fibrous body is impregnated with the conductive material.
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2. A manufacturing method of a wiring substrate, comprising the steps of:
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impregnating a first region of a sheet-like fibrous body with a conductive resin, whereby forming a wiring, the wiring penetrating the sheet-like fibrous body; and impregnating a second region of the sheet-like fibrous body with an insulating resin layer, the second region surrounding the first region, wherein a portion of the sheet-like fibrous body is positioned in the wiring, and wherein the wiring is exposed on both surfaces of the insulating resin layer.
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3. A semiconductor device comprising:
a resin-impregnated fibrous-body composite substrate including an insulating resin layer provided on both surfaces of a sheet-like fibrous body, the sheet-like fibrous body impregnated with the insulating resin layer; and a first wiring surrounded by the insulating resin layer, the first wiring comprising a conductive material, the first wiring penetrating the sheet-like fibrous body, wherein a portion of the sheet-like fibrous body is positioned in the first wiring, wherein the first wiring is exposed on both surfaces of the insulating resin layer, and wherein the sheet-like fibrous body is impregnated with the conductive material; and an integrated circuit chip including a thin film transistor; an insulating layer over the thin film transistor; and a second wiring on the insulating layer, wherein the integrated circuit chip is in close contact with the resin-impregnated fibrous-body composite substrate so that the second wiring is in contact with the first wiring.
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4. A manufacturing method of a semiconductor device comprising the steps of:
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forming a thin film transistor; forming an insulating layer over the thin film transistor; forming a second wiring on the insulating layer; impregnating a first region of a sheet-like fibrous body with a conductive resin, whereby forming a first wiring, the first wiring being in contact with the second wiring, the first wiring penetrating the sheet-like fibrous body; and impregnating a second region of the sheet-like fibrous body with an insulating resin layer, the second region surrounding the first region, wherein a portion of the sheet-like fibrous body is positioned in the first wiring, and wherein the first wiring is exposed on both surfaces of the insulating resin layer.
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Specification