×

SYSTEMS, DEVICES, AND METHODS FOR SEMICONDUCTOR DEVICE TEMPERATURE MANAGEMENT

  • US 20090302461A1
  • Filed: 06/08/2009
  • Published: 12/10/2009
  • Est. Priority Date: 06/06/2008
  • Status: Active Grant
First Claim
Patent Images

1. An Integrated Circuit (IC) device, comprising:

  • a semiconductor die that includes a plurality of integral device layers and a plurality of semiconductor device structures embedded within the plurality of integral device layers;

    at least one coolant reservoir constructed to hold a coolant fluid;

    at least one coolant channel in fluid communication with said coolant reservoir and constructed to locally interface with at least one of said plurality of semiconductor device structures; and

    wherein said coolant reservoir and said coolant channel are disposed wholly within said semiconductor die and are constructed and arranged to permit a fluid disposed within said at least one coolant reservoir to circulate through said at least one coolant channel to manage an operating temperature of said IC.

View all claims
  • 3 Assignments
Timeline View
Assignment View
    ×
    ×