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Prepreg, Method for Manufacturing Prepreg, Substrate, and Semiconductor Device

  • US 20090302462A1
  • Filed: 11/30/2006
  • Published: 12/10/2009
  • Est. Priority Date: 12/01/2005
  • Status: Active Grant
First Claim
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1. A prepreg, comprising:

  • a core layer including a sheet-shaped base member, the core layer having one surface and the other surface which is opposite to the one surface;

    a first resin layer provided on the one surface of the core layer, the first resin layer formed of a first resin composition; and

    a second resin layer provided on the other surface of the core layer, the second resin layer formed of a second resin composition,wherein at least one of a requirement that a thickness of the first resin layer is different from that of the second resin layer and a requirement that a constitution of the first resin composition is different from that of the second resin composition is satisfied.

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