Acoustic Sensor and Method

• US 20090303838A1
• Filed: 06/06/2006
• Published: 12/10/2009
• Est. Priority Date: 06/29/2005
• Status: Abandoned Application

• Current Assignee: Oceanscan Limited (Oceanscan Holdings Ltd.)
• Original Assignee: Oceanscan Limited (Oceanscan Holdings Ltd.)
• Inventors: Svet, Victor Darievich
• Application Number:
  US11/988,054
• Publication Number:
  US 20090303838A1
• Time in Patent Office: Days
• US Class Current: 367/157
• CPC Class Codes: G01N 2291/0258 Structural degradation, e.g. fatigue of composites, ageing of oils
• CPC Class Codes: G01N 29/075 by measuring or comparing phase angle measuring frequencies or phase angles per se G01R23/00, G01R25/00
• CPC Class Codes: G01N 29/245 Ceramic probes, e.g. lead zirconate titanate [PZT] probes
• CPC Class Codes: G10K 11/346 using phase variation
• CPC Class Codes: Y10T 29/49005 Acoustic transducer

Abstract

The invention relates to a sensor apparatus (30) operable to receive and process acoustic signals. The sensor apparatus comprises at least one acoustic transducer (32) operative to produce a change in an electronic output signal in response to receipt of an acoustic signal by the acoustic transducer. The sensor apparatus also comprises processing circuitry (34) configured to receive a first electronic output signal and a second electronic output signal produced by the at least one acoustic transducer. The processing circuitry is operative to shift a phase of the first electronic output signal and the second electronic output signal in relation to each other. The acoustic transducer and the processing circuitry of the sensor apparatus are juxtaposed such that they form a unitary body.

Claims

1. A sensor apparatus comprising:

a plurality of acoustic transducers, each being operative to produce a change in an electronic output signal in response to receipt of an acoustic signal; and

a plurality of processing circuitry, each being juxtaposed with a different, respective acoustic transducer such that a plurality of unitary bodies are formed;

each of the plurality of processing circuitry being configured to receive a first electronic output signal and a second electronic output signal produced by its respective acoustic transducer, and each processing circuitry being operative to shift a phase of the first electronic output signal and the second electronic output signal in relation to each other.

2. Apparatus according to claim 1, in which each of the plurality of acoustic transducers is operative to produce at least one of a change in a charge level and a change in a voltage level in response to receipt of an acoustic signal.

3. Apparatus according to claim 1, in which each of the plurality of acoustic transducers comprises a piezoelectric transducer (PZT) operative to produce a change in a charge level.

4. Apparatus according to claim 3, in which each piezoelectric transducer comprises a member formed of at least one of Polyvinylidene Fluoride (PVDF) and a piezoceramic material.

5. Apparatus according to claim 1, in which each processing circuitry comprises an analogue shift register configured to receive each of the first electronic output signal and the second electronic output signal and to shift the phase of the first electronic output signal and the second electronic output signal in relation to each other.

6. Apparatus according to claim 5, in which the analogue shift register is controllable to change a time delay of an electronic output signal passing through the shift register.

7. Apparatus according to claim 5, in which the analogue shift register comprises a Charge Coupled Device (CCD) configured to receive each of the first electronic output signal and the second electronic output signal and to shift the phase of the first electronic output signal and the second electronic output signal in relation to each other.

10. Apparatus according to claim 1, in which the sensor apparatus further comprises at least one amplifier configured to amplify a magnitude of an electrical signal received by the amplifier.

11. Apparatus according to claim 10, in which the sensor apparatus is configured such that the amplifier receives an electrical signal from an acoustic transducer and provides an amplified electrical signal to the processing circuitry.

12. Apparatus according to claim 1, in which the sensor apparatus further comprises at least one buffer configured to substantially maintain an output connection of the buffer at a signal level corresponding to a signal level at an input to the buffer where a load within a predetermined limit is applied at the output connection of the buffer.

13. Apparatus according to claim 11, in which the sensor apparatus is configured such that the buffer receives an. electrical signal from an acoustic transducer and provides a buffered electrical signal to the processing circuitry.

14. Apparatus according to claim 1, in which the plurality of acoustic transducers are formed as separate bodies from the plurality of processing circuitry, and respective acoustic transducers and processing circuitry are rigidly coupled to each other.

15. Apparatus according to claim 14, in which electrical contacts of each acoustic transducer are electrically and mechanically coupled to electrical contacts of its respective processing circuitry to provide rigid coupling between each acoustic transducer and its respective processing circuitry.

16. Apparatus according to claim 15, in which the sensor apparatus comprises a plurality of rigid and electrically conductive connecting elements that provide the electrical and mechanical coupling of the respective contacts of each acoustic transducer and its respective processing circuitry.

17. Apparatus according to claim 16, in which the connecting elements are formed at least in part of solder.

18. Apparatus according to claim 1, in which a juxtaposed acoustic transducer and processing circuitry form part of a monolithic body.

19. Apparatus according to claim 18, in which the acoustic transducer and the processing circuitry are disposed on a semiconducting substrate.

20. Hydro-acoustics apparatus comprising a sensor apparatus according to claim 1.

21. Apparatus according to claim 19, in which the processing circuitry is formed in and over the semiconducting substrate and the acoustic transducer is disposed over the processing circuitry.

22. Sonar apparatus comprising a sensor apparatus according to claim 1.

23. A sea going vessel comprising hydro-acoustics apparatus according to claim 20.

32. Apparatus according to claim 1, in which each processing circuitry has a footprint no greater than a footprint of its respective acoustic transducer.

8. (canceled)

9. (canceled)

24. (canceled)

25. (canceled)

26. A method of forming a sensor apparatus comprising the step of juxtaposing each of a plurality of acoustic transducers with a different, respective one of a plurality of processing circuitry such that they form a plurality of unitary bodies, each of the plurality of acoustic transducers, in use, being operative to produce a change in an electronic output signal in response to receipt of an acoustic signal by the acoustic transducer, the respective processing circuitry being configured to receive a first electronic output signal and a second electronic output signal produced by the acoustic transducer, the processing circuitry, in use, being operative to shift a phase of the first electronic output signal and the second electronic output signal in relation to each other.

27. The method according to claim 26, in which the method comprises forming each acoustic transducer and its respective processing circuitry as separate bodies, followed by rigidly coupling each acoustic transducer and its respective processing circuitry such that the acoustic transducer and the processing circuitry are juxtaposed in a unitary body.

28. The method according to claim 27, in which the acoustic transducer and the respective processing circuitry are rigidly coupled by the step of electrically and mechanically coupling electrical contacts of the acoustic transducer to electrical contacts of the processing circuitry.

29. The method according to claim 28, in which the step of electrically and mechanically coupling the respective electrical contacts comprises soldering the respective contacts to each other.

30. The method according to claim 26, in which the method comprises forming respective ones of the plurality of acoustic transducers and the plurality of processing circuitry as part of a monolithic body.

31. The method according to claim 30, in which the method comprises disposing the respective ones of the plurality of acoustic transducers and the plurality of processing circuitry on a semiconducting substrate.