SPUTTERING COMPOSITE TARGET, METHOD FOR MANUFACUTURING TRANSPARENT CONDUCTIVE FILM USING THE SAME AND TRANSPARENT CONDUCTIVE FILM-PROVIDED BASE MATERIAL

• US 20090305066A1
• Filed: 06/04/2009
• Published: 12/10/2009
• Est. Priority Date: 06/06/2008
• Status: Active Grant

• Current Assignee: Sony Chemical & Information Device Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Hommura, Hayato, Katori, Kenji, Sudo, Go
• Granted Patent: US 8,338,002 B2
• Time in Patent Office: Days
• US Class Current: 428/480
• CPC Class Codes: C23C 14/086 of zinc, germanium, cadmium, indium, tin, thallium or bismuth
• CPC Class Codes: C23C 14/3407 Cathode assembly for sputtering apparatus, e.g. Target
• CPC Class Codes: Y10T 428/24802 Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
• CPC Class Codes: Y10T 428/30 Self-sustaining carbon mass or layer with impregnant or other layer
• CPC Class Codes: Y10T 428/31786 Of polyester [e.g., alkyd, etc.]
• CPC Class Codes: Y10T 428/31938 Polymer of monoethylenically unsaturated hydrocarbon

Abstract

A sputtering composite target includes: an oxide based component containing indium oxide; and a carbon based component.

Claims

1. A sputtering composite target comprising:

an oxide-based component containing indium oxide; and

a carbon-based component.

2. The sputtering composite target according to claim 1, wherein the sputtering composite target comprises at least one element selected from the group consisting of tin, zinc, tungsten and germanium.

3. The sputtering composite target according to claim 1, wherein the sputtering composite target is obtained by laminating the carbon-based component on at least a part of a surface of the oxide-based component.

4. The sputtering composite target according to claim 3, wherein when a maximum surface area of the oxide-based component is defined as a target surface area, an area ratio occupied by the carbon-based component is from 2 to 15% relative to 100% of the target surface area.

5. The sputtering composite target according to claim 1, wherein a content of the carbon-based component is from 0.6 to 6.0 parts by weight based on 100 parts by weight of the oxide-based component.

6. The sputtering composite target according to claim 1, wherein the oxide-based component is a sintered body, and the carbon-based component is a non-sintered body.

7. The sputtering composite target according to claim 2, wherein a proportion of a content of the element is from 1.0 to 30.0% by mass.

8. A method for manufacturing a transparent conductive film comprising the act of:

forming a transparent conductive film on a substrate using a sputtering composite target comprising an oxide-based component containing indium oxide and a carbon-based component.

10. The method for manufacturing a transparent conductive film according to one of claim 8 and 9, wherein the substrate is a sheet or film of a plastic.

11. The method for manufacturing a transparent conductive film according to one of claim 8 and 9, wherein the substrate is not heated.

9. A method for manufacturing a transparent conductive film comprising the acts of:

providing, as a first target, an oxide-based component containing indium oxide and, as a second target, a carbon-based component;

disposing the first target and the second target in a different position from each other; and

sputtering the first target and the second target together to form a transparent conductive film on a substrate.

12. A transparent conductive film-provided base material comprising:

an indium oxide-based transparent conductive film formed on a sheet or film of a plastic.

13. The transparent conductive film-provided base material according to claim 12, wherein the plastic is polyethylene (PE), polypropylene (PP) or polyethylene terephthalate (PET).