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COMPACT MULTI-PORT CAM CELL IMPLEMENTED IN 3D VERTICAL INTEGRATION

  • US 20090305462A1
  • Filed: 08/17/2009
  • Published: 12/10/2009
  • Est. Priority Date: 05/18/2007
  • Status: Active Grant
First Claim
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1. A method of forming a multi-ported CAM cell comprising:

  • providing a first wafer including a plurality of first transistors located upon and within a surface of a first active semiconductor layer;

    providing a second wafer including a plurality of second transistors located upon and within a surface of a second active semiconductor layer;

    first bonding a surface of said second wafer to a surface of said first wafer to provide a bonded structure in which the plurality of first transistors are located above the plurality of second transistors;

    providing at least one other wafer including a plurality of other transistors located upon and within a surface of at least one other active semiconductor layer;

    second bonding the at least one another wafer to a surface of said second wafer to provide another bonded structure in which each plurality of transistors are vertically stacked upon each other; and

    forming at least one vertically filled conductive via to connect said plurality of transistors that are vertically stacked to each other.

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