Carrier for double-side polishing apparatus, double-side polishing apparatus using the same, and double-side polishing method
First Claim
1. A carrier for double-side polishing apparatus which is set between upper and lower turn tables having polishing pads attached thereto and has a holding hole in which a semiconductor wafer sandwiched between the upper and lower turn tables is held at the time of polishing in a double-side polishing apparatus, wherein a material of the carrier is titanium, and surface roughness of the titanium carrier is 0.14 μ
- m or above in terms of Ra.
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Accused Products
Abstract
The present invention provides a carrier for double-side polishing apparatus which is set between upper and lower turn tables having polishing pads attached thereto and has a holding hole in which a semiconductor wafer sandwiched between the upper and lower turn tables is held at the time of polishing in a double-side polishing apparatus, wherein a material of the carrier is titanium, and surface roughness of the titanium carrier is 0.14 μm or above in terms of Ra. As a result, there can be provided the carrier for double-side polishing apparatus, a double-side polishing apparatus, and a double-side polishing method that can stably and efficiently produce a high-quality wafer having reduced wafer peripheral sag and a high flatness at the time of double-side polishing of a semiconductor wafer.
37 Citations
18 Claims
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1. A carrier for double-side polishing apparatus which is set between upper and lower turn tables having polishing pads attached thereto and has a holding hole in which a semiconductor wafer sandwiched between the upper and lower turn tables is held at the time of polishing in a double-side polishing apparatus, wherein a material of the carrier is titanium, and surface roughness of the titanium carrier is 0.14 μ
- m or above in terms of Ra.
- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
Specification