PACKAGING MATERIAL WITH ELECTROMAGNETIC COUPLING MODULE
First Claim
1. A packaging material with an electromagnetic coupling module comprising:
- a packaging material including a liner, and a core material connected to the liner;
an electromagnetic coupling module including a radio IC chip and a feeder circuit board on which the radio IC chip is mounted, the feeder circuit board including a resonant circuit that includes an inductance element and has a predetermined resonant frequency; and
a radiator electromagnetically coupled to the feeder circuit board;
whereinthe radiator is arranged inside of the packaging material; and
the electromagnetic coupling module is arranged on the radiator or adjacent to the radiator inside of the packaging material.
1 Assignment
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Accused Products
Abstract
A packaging material with an electromagnetic coupling module for a RFID system, is constructed such that a radio IC chip is protected from external shock and environmental change without adversely affecting the planarity of the packaging material, the assembly of a radiator and an electromagnetic coupling module is facilitated, and the radiation characteristics are satisfactory. A packaging material includes a liner and a wave-shaped core material, wherein an electromagnetic coupling module and a radiator that are electromagnetically coupled to each other are arranged inside of the packaging material. The electromagnetic coupling module includes a radio IC chip and a feeder circuit board, on which the radio IC chip is mounted, the feeder circuit board including a resonant circuit that includes an inductance element. The radiator electromagnetically couples with the electromagnetic coupling module to transmit/receive high frequency signals.
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Citations
12 Claims
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1. A packaging material with an electromagnetic coupling module comprising:
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a packaging material including a liner, and a core material connected to the liner; an electromagnetic coupling module including a radio IC chip and a feeder circuit board on which the radio IC chip is mounted, the feeder circuit board including a resonant circuit that includes an inductance element and has a predetermined resonant frequency; and a radiator electromagnetically coupled to the feeder circuit board;
whereinthe radiator is arranged inside of the packaging material; and the electromagnetic coupling module is arranged on the radiator or adjacent to the radiator inside of the packaging material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification