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PACKAGING MATERIAL WITH ELECTROMAGNETIC COUPLING MODULE

  • US 20090305635A1
  • Filed: 08/06/2009
  • Published: 12/10/2009
  • Est. Priority Date: 02/06/2007
  • Status: Abandoned Application
First Claim
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1. A packaging material with an electromagnetic coupling module comprising:

  • a packaging material including a liner, and a core material connected to the liner;

    an electromagnetic coupling module including a radio IC chip and a feeder circuit board on which the radio IC chip is mounted, the feeder circuit board including a resonant circuit that includes an inductance element and has a predetermined resonant frequency; and

    a radiator electromagnetically coupled to the feeder circuit board;

    whereinthe radiator is arranged inside of the packaging material; and

    the electromagnetic coupling module is arranged on the radiator or adjacent to the radiator inside of the packaging material.

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