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SYSTEMS, DEVICES, AND METHODS FOR SEMICONDUCTOR DEVICE TEMPERATURE MANAGEMENT

  • US 20090307646A1
  • Filed: 06/08/2009
  • Published: 12/10/2009
  • Est. Priority Date: 06/06/2008
  • Status: Abandoned Application
First Claim
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1. A computer-based method of designing a temperature regulated Integrated Circuit (IC) device, comprising:

  • acquiring at least one electronic representation of a physical layout of an IC device that includes at least one representation of a plurality of integral device layers and at least one indication of a physical placement of at least one semiconductor device structure embedded in said plurality of integral device layers;

    acquiring at least one electronic representation of a thermal model of said IC device;

    acquiring at least one design parameter;

    identifying, based on said at least one thermal model, at least one region of said IC device susceptible to high temperature operation;

    automatically determining a physical design of at least one intra-die fluid cooling structure, wherein at least one portion of said fluid cooling structure is adapted to locally interface with said at least one region of said IC device to channel a coolant fluid proximal to said region; and

    automatically creating at least one electronic representation of said physical design of said at least one intra-die fluid cooling structure.

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