SYSTEMS, DEVICES, AND METHODS FOR SEMICONDUCTOR DEVICE TEMPERATURE MANAGEMENT
First Claim
1. A computer-based method of designing a temperature regulated Integrated Circuit (IC) device, comprising:
- acquiring at least one electronic representation of a physical layout of an IC device that includes at least one representation of a plurality of integral device layers and at least one indication of a physical placement of at least one semiconductor device structure embedded in said plurality of integral device layers;
acquiring at least one electronic representation of a thermal model of said IC device;
acquiring at least one design parameter;
identifying, based on said at least one thermal model, at least one region of said IC device susceptible to high temperature operation;
automatically determining a physical design of at least one intra-die fluid cooling structure, wherein at least one portion of said fluid cooling structure is adapted to locally interface with said at least one region of said IC device to channel a coolant fluid proximal to said region; and
automatically creating at least one electronic representation of said physical design of said at least one intra-die fluid cooling structure.
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Accused Products
Abstract
Devices, systems, and methods for semiconductor die temperature management are described and discussed herein. An IC device is described that includes at least one intra-die cooling structure. In an embodiment, the IC device includes a semiconductor die formed of integral device layers and further includes at least one coolant reservoir and at least one coolant channel. In an embodiment, the at least one coolant reservoir and at least one coolant channel are disposed wholly within the semiconductor die. In various embodiments, at least one coolant reservoir and at least one coolant channel are constructed and arranged to circulate coolant fluid in proximity to at least one IC device structure in order to decrease and or normalize an operating temperature of the IC device. In other embodiments, systems and methods for designing and/or fabricating IC die that include at least one intra-die cooling structure are provided herein.
55 Citations
18 Claims
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1. A computer-based method of designing a temperature regulated Integrated Circuit (IC) device, comprising:
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acquiring at least one electronic representation of a physical layout of an IC device that includes at least one representation of a plurality of integral device layers and at least one indication of a physical placement of at least one semiconductor device structure embedded in said plurality of integral device layers; acquiring at least one electronic representation of a thermal model of said IC device; acquiring at least one design parameter; identifying, based on said at least one thermal model, at least one region of said IC device susceptible to high temperature operation; automatically determining a physical design of at least one intra-die fluid cooling structure, wherein at least one portion of said fluid cooling structure is adapted to locally interface with said at least one region of said IC device to channel a coolant fluid proximal to said region; and automatically creating at least one electronic representation of said physical design of said at least one intra-die fluid cooling structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A computer-based method of designing a temperature regulated Integrated Circuit (IC) device, comprising:
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acquiring at least one electronic representation of a physical layout of an IC device that includes at least one representation of a semiconductor substrate and at least one indication of a physical placement of at least one semiconductor device structure embedded in said at least one semiconductor substrate; acquiring at least one electronic representation of a thermal model of said IC device; identifying, based on said at least one electronic representation of a physical layout of said IC device, at least one fluid channel routing region adapted to receive at least one portion of at least one fluid cooling structure disposed wholly within said at least one semiconductor substrate of said IC device; automatically determining a physical design of said at least one fluid cooling structure to achieve a desired thermal operation of said IC, wherein at least one portion of said fluid cooling structure is constructed to be disposed within said at least one fluid channel routing region; and automatically creating at least one electronic representation of said physical design of said at least one fluid cooling structure.
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16. A computer-based method of designing a temperature regulated Integrated Circuit (IC) device, comprising:
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acquiring at least one electronic representation of a physical design of at least one intra-die fluid cooling structure; enabling generation of at least one electronic representation of a physical layout of an IC device that includes at least one representation of a semiconductor substrate and at least one indication of a physical placement of at least one semiconductor device structure embedded in said at least one semiconductor substrate, wherein said enabling includes enabling said generation based on said electronic representation of a physical design of at least one intra-die fluid cooling structure; and providing at least one electronic representation of said physical design of at least one intra-die fluid cooling structure and at least one electronic representation of a physical layout of said IC device.
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17. A computer-based system for the design of at least one IC device that includes at least one intra-die cooling structure, comprising:
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at least one user interface adapted to receive one or more inputs and present information; at least one coolant reservoir module adapted to enable creation of at least one intra-die coolant reservoir; at least one coolant channel module adapted to enable creation of at least one intra-die coolant channel in fluid communication with said at least one intra-die coolant reservoir; at least one multi-physics analysis module constructed to enable verification of said at least one intra-die coolant reservoir and said at least one intra-die coolant channel; and at least one physical design generation module adapted to enable creation of at least one electronic representation of a physical design of said intra-die cooling structure.
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18. A computer-based system for the design of at least one IC device that includes at least one intra-die cooling structure, comprising:
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at least one user interface adapted to receive one or more inputs and present information; coolant reservoir creation and analysis means for enabling creation of at least one intra-die coolant reservoir; coolant reservoir creation and analysis means for enabling creation of at least one intra-die coolant channel in fluid communication with said at least one intra-die coolant reservoir; cooling structure analysis means for enabling verification of said at least one intra-die coolant reservoir and said at least one intra-die coolant channel; and physical design generation means for enabling creation of at least one electronic representation of a physical design of said intra-die cooling structure.
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Specification