INTEGRATED INERTIAL MEASUREMENT SYSTEM AND METHODS OF CONSTRUCTING THE SAME
First Claim
1. A method of constructing an integrated inertial measurement unit, the method comprising the steps of:
- a) forming a base structure having three mutually orthogonal planar surfaces and a bottom surface, the bottom surface having a central aperture, each of the planar surfaces forming a junction with the bottom surface;
b) bridging each of the junctions with a metallization layer; and
c) surface mounting an inertial module on each of the planar surfaces, the inertial module interfacing with at least a portion of the metallization layer.
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Accused Products
Abstract
An inertial measurement system having a triangular cupola shaped base structure with three mutually orthogonal sides and a bottom surface surrounding a hollow core. The bottom surface includes an aperture providing access to the hollow core. An inertial module is mounted on each of the sides and includes a gyroscopic rotational rate sensor and a linear accelerometer connected to a circuit board. The inertial measurement system also includes a motherboard and a plurality of metallization elements. The metallization elements extend from the bottom surface to the sides of the base structure and conductively connect the inertial module to the motherboard. The inertial measurement system may also include a non-conductive adhesive underfill positioned between the inertial module and the base structure.
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Citations
26 Claims
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1. A method of constructing an integrated inertial measurement unit, the method comprising the steps of:
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a) forming a base structure having three mutually orthogonal planar surfaces and a bottom surface, the bottom surface having a central aperture, each of the planar surfaces forming a junction with the bottom surface; b) bridging each of the junctions with a metallization layer; and c) surface mounting an inertial module on each of the planar surfaces, the inertial module interfacing with at least a portion of the metallization layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. An inertial measurement system comprising:
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a) a base structure with three mutually orthogonal sides and a bottom surface surrounding a hollow core, the bottom surface having an aperture providing access to the hollow core; b) an inertial module mounted on each side, the inertial module including a gyroscopic rotational rate sensor and a linear accelerometer connected to a circuit board; c) a plurality of metallization elements extending from the bottom surface to the sides of the base structure for conductively connecting the inertial module to a motherboard. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25)
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26. An inertial measurement system comprising:
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a) a base structure with three mutually orthogonal sides and a bottom surface surrounding a hollow core, the bottom surface having an aperture providing access to the hollow core; b) a circuit card assembly mounted on each side, the circuit card assembly including a plurality of microelectromechanical components mounted directly to the circuit card assembly; c) a plurality of metallization elements extending from the bottom surface to the sides of the bases structure for conductively connecting the circuit card assembly to a motherboard.
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Specification