SEMICONDUCTOR PROCESSING APPARATUS WITH IMPROVED THERMAL CHARACTERISTICS AND METHOD FOR PROVIDING THE SAME
First Claim
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4-1. Part according to claim 1, wherein a surface of the heat reflective coating has been sealed, for example by means of flame polishing.
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Abstract
A semiconductor processing apparatus is disclosed, comprising a process chamber configured to contain a heated, gaseous atmosphere, the apparatus further comprising a number of mechanical parts, at least one of which parts is provided at least partly with a heat reflective, amorphous SiO2 powder coating. Also disclosed is a method for treating a component of a semiconductor processing apparatus, comprising at least partly providing a surface of the component with an amorphous SiO2 powder coating, and optionally sealing a surface of the applied coating.
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Citations
16 Claims
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4-1. Part according to claim 1, wherein a surface of the heat reflective coating has been sealed, for example by means of flame polishing.
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13. Method for treating a component of a semiconductor processing apparatus, said apparatus utilizing heated process gases and said component—
- during operation—
being exposed to the heated process gases, comprising;at least partly providing a surface of the component with a coating made of amorphous SiO2 powder. - View Dependent Claims (14, 15, 16)
- during operation—
Specification