ASSEMBLY INCLUDING PLURAL THROUGH WAFER VIAS, METHOD OF COOLING THE ASSEMBLY AND METHOD OF FABRICATING THE ASSEMBLY

• US 20090308578A1
• Filed: 08/20/2009
• Published: 12/17/2009
• Est. Priority Date: 10/31/2007
• Status: Active Grant

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Brunschwiler, Thomas, Bernstein, Kerry, Michel, Bruno
• Granted Patent: US 8,487,427 B2
• Time in Patent Office: Days
• US Class Current: 165/104.330
• CPC Class Codes: H01L 21/76898 formed through a semiconductor substrate
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2225/06541 Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV] manufacturing via connections per se H01L21/76898
• CPC Class Codes: H01L 2225/06589 Thermal management, e.g. cooling
• CPC Class Codes: H01L 23/34 Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 23/46 involving the transfer of heat by flowing fluids H01L23/42, H01L23/44 take precedence
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 23/488 consisting of soldered or bonded constructions bump connectors H01L24/01
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 2924/15159 Side view
• CPC Class Codes: H01L 2924/3011 Impedance

Abstract

An assembly includes a chip including an integrated circuit, a casing including an integrated circuit and having an upper portion formed on a side of the chip and lower portion formed on another side of the chip, plural through-wafer vias (TWVs) for electrically connecting the integrated circuit of the chip and the integrated circuit of the casing, and a card connected to the casing for electrically connecting the casing to a system board.

Claims

1. A method of cooling a chip stack in an assembly, comprising:

transporting a coolant fluid to said chip stack through an inlet formed in a casing, said casing including an integrated circuit including plural active elements, said casing being electrically connected to an integrated circuit of a chip in said chip stack by plural through wafer vias;

transporting said coolant fluid in a fluid channel formed between chips in said chip stack; and

transporting said coolant fluid from said chip stack through an outlet formed in a casing.

2. The method of claim 1, wherein said fluid channel is formed between an upper surface of a silicon die formed on a first chip in said chip stack, and a lower surface of a second chip formed above said first chip in said chip stack.