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THERMAL PROCESSING APPARATUS AND THERMAL PROCESSING METHOD FOR OBJECT TO BE PROCESSED

  • US 20090311807A1
  • Filed: 06/10/2009
  • Published: 12/17/2009
  • Est. Priority Date: 06/11/2008
  • Status: Active Grant
First Claim
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1. A thermal processing apparatus comprising:

  • a processing vessel capable of being evacuated, the processing vessel also being capable of accommodating, in addition to a plurality of objects to be processed, an object for temperature measurement equipped with an elastic wave device;

    a holding unit configured to be loaded into and unloaded from the processing vessel, while the holding unit holding the plurality of objects to be processed and the object for temperature measurement;

    a gas introduction unit configured to introduce a gas into the processing vessel;

    a heating unit configured to heat the plurality of objects to be processed and the object for temperature measurement that are accommodated in the processing vessel;

    a first conductive member configured to function as a transmitter antenna connected to a transmitter through a radiofrequency line, for transmitting an electric wave for measurement toward the elastic wave device accommodated in the processing vessel;

    a second conductive member configured to function as a receiver antenna connected to a receiver through a radiofrequency line, for receiving an electric wave dependent on a temperature of the elastic wave device which is emitted from the elastic wave device accommodated in the processing vessel;

    a temperature analysis part configured to obtain a temperature of the object for temperature measurement based on the electric wave received by the receiver antenna; and

    a temperature control part configured to control the heating unit;

    wherein;

    the first conductive member is disposed as a part of a thermal processing part in the processing vessel; and

    the second conductive member is disposed as a part of a thermal processing part in the processing vessel.

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