METHOD AND SYSTEM FOR SUPPLYING A CLEANING GAS INTO A PROCESS CHAMBER
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Abstract
A method and apparatus for cleaning a process chamber are provided. In one embodiment, a process chamber is provided that includes a remote plasma source and a process chamber having at least two processing regions. Each processing region includes a substrate support assembly disposed in the processing region, a gas distribution system configured to provide gas into the processing region above the substrate support assembly, and a gas passage configured to provide gas into the processing region below the substrate support assembly. A first gas conduit is configured to flow a cleaning agent from the remote plasma source through the gas distribution assembly in each processing region while a second gas conduit is configured to divert a portion of the cleaning agent from the first gas conduit to the gas passage of each processing region.
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Citations
20 Claims
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1-12. -12. (canceled)
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13. A method for supplying plasma into a process chamber, comprising:
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providing a remote plasma source coupled to each of two separate processing regions through a first gas conduit configured to provide a first volume of a cleaning agent into each of the processing regions above a substrate support assembly disposed in each of two separate processing regions and a second gas conduit configured to provide a second volume of the cleaning agent into each of the two separate processing regions below the substrate support assembly; flowing the first volume of the cleaning agent from the remote plasma source through the first gas conduit into an interior volumes of each of the two separate processing regions; and flowing the second volume of the cleaning agent from the remote plasma source through the second gas conduit into the interior volume of each of the two separate processing regions by ports located below each of the substrate support assemblies. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification