Bonded Microfluidics System Comprising CMOS-Controllable Microfluidic Devices
First Claim
1. A microfluidic system comprising an integrated circuit having a bonding surface bonded to a polymeric microfluidics platform, said microfluidic system comprising one or more microfluidics devices controlled by control circuitry in said integrated circuit,wherein at least one of said microfluidic devices comprises a MEMS actuator positioned in a MEMS layer of said integrated circuit, said MEMS layer being covered with a polymeric layer which defines said bonding surface of said integrated circuit.
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Abstract
A microfluidic system comprising an integrated circuit having a bonding surface bonded to a polymeric microfluidics platform. The microfluidic system comprises one or more microfluidics devices controlled by control circuitry in the integrated circuit. At least one of the microfluidic devices comprises a MEMS actuator positioned in a MEMS layer of the integrated circuit. The MEMS layer is covered with a polymeric layer which defines the bonding surface of the integrated circuit.
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Citations
17 Claims
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1. A microfluidic system comprising an integrated circuit having a bonding surface bonded to a polymeric microfluidics platform, said microfluidic system comprising one or more microfluidics devices controlled by control circuitry in said integrated circuit,
wherein at least one of said microfluidic devices comprises a MEMS actuator positioned in a MEMS layer of said integrated circuit, said MEMS layer being covered with a polymeric layer which defines said bonding surface of said integrated circuit.
Specification