Bonded Microfluidics System Comprising CMOS-Controllable Microfluidic Devices

• US 20090314367A1
• Filed: 06/20/2008
• Published: 12/24/2009
• Est. Priority Date: 06/20/2008
• Status: Abandoned Application

• Current Assignee: Silverbrook Research Pty Limited
• Original Assignee: Silverbrook Research Pty Limited
• Inventors: Silverbrook, Kia, Kerr, Emma Rose, McAvoy, Gregory John
• Application Number:
  US12/142,783
• Publication Number:
  US 20090314367A1
• Time in Patent Office: Days
• US Class Current: 137/828
• CPC Class Codes: B01L 3/50273 characterised by the means or forces applied to move the fluids micropumps F04B19/006, of the membrane type F04B43/043
• CPC Class Codes: B01L 3/502738 characterised by integrated valves microvalves F16K99/0001
• CPC Class Codes: B81B 2201/052 Ink-jet print cartridges
• CPC Class Codes: B81C 1/00253 Processes for integrating an electronic processing unit with a micromechanical structure not provided for in B81C1/0023 - B81C1/00246
• CPC Class Codes: C08L 2201/12 Shape memory
• CPC Class Codes: F04B 43/043 Micropumps
• CPC Class Codes: F04B 43/14 having plate-like flexible members
• CPC Class Codes: F16K 2099/0084 Chemistry or biology, e.g. "lab-on-a-chip" technology
• CPC Class Codes: F16K 2099/0094 Micropumps
• CPC Class Codes: F16K 99/0001 Microvalves microdevices B81B1/00; manufacture or treatment of devices or systems in or on a substrate B81C1/00; microfluidic structures B01L3/5027; micropumps F04B19/006
• CPC Class Codes: F16K 99/0015 Diaphragm or membrane valves
• CPC Class Codes: F16K 99/0021 No-moving-parts valves
• CPC Class Codes: F16K 99/0038 using shape memory alloys
• CPC Class Codes: F16K 99/0044 using thermo-electric means
• CPC Class Codes: Y10T 137/212 System comprising plural fluidic devices or stages
• CPC Class Codes: Y10T 137/2196 Acoustical or thermal energy
• CPC Class Codes: Y10T 137/2213 Electrically-actuated element [e.g., electro-mechanical transducer]
• CPC Class Codes: Y10T 137/2218 Means [e.g., valve] in control input

Abstract

A microfluidic system comprising an integrated circuit having a bonding surface bonded to a polymeric microfluidics platform. The microfluidic system comprises one or more microfluidics devices controlled by control circuitry in the integrated circuit. At least one of the microfluidic devices comprises a MEMS actuator positioned in a MEMS layer of the integrated circuit. The MEMS layer is covered with a polymeric layer which defines the bonding surface of the integrated circuit.

Claims

1. A microfluidic system comprising an integrated circuit having a bonding surface bonded to a polymeric microfluidics platform, said microfluidic system comprising one or more microfluidics devices controlled by control circuitry in said integrated circuit,

wherein at least one of said microfluidic devices comprises a MEMS actuator positioned in a MEMS layer of said integrated circuit, said MEMS layer being covered with a polymeric layer which defines said bonding surface of said integrated circuit.

2. The microfluidic system of claim 1, wherein said microfluidic devices are selected from the group comprising:

microfluidic valves and microfluidic pumps.

3. The microfluidic system of claim 1, wherein said microfluidic devices are positioned in any one of:

said integrated circuit;

said microfluidics platform; and

an interface between said integrated circuit and said microfluidics platform.

4. The microfluidic system of claim 1, wherein said integrated circuit comprises a silicon substrate having at least one CMOS layer, and said control circuitry is contained in said at least one CMOS layer.

5. The microfluidic system of claim 1, wherein said integrated circuit comprises a silicon substrate and said MEMS layer is formed on said substrate.

6. The microfluidic system of claim 1, wherein said polymeric layer is comprised of photopatternable PDMS.

7. The microfluidic system of claim 1, wherein said microfluidics platform comprises a polymeric body having one or more microfluidic channels defined therein.

8. The microfluidic system of claim 7, wherein said polymeric body is comprised of PDMS.

9. The microfluidic system of claim 7, wherein at least one of said microfluidic channels is in fluid communication with at least one said microfluidic devices.

10. The microfluidic system of claim 1, wherein said MEMS actuator is a thermal bend actuator.

11. The microfluidic system of claim 10, wherein said thermal bend actuator comprises:

an active beam comprised of a thermoelastic material; and

a passive beam mechanically cooperating with said active beam, such that when a current is passed through the active beam, the active beam heats and expands relative to the passive beam, resulting in bending of the actuator.

12. The microfluidic system of claim 11, wherein said active beam is fused to said passive beam.

13. The microfluidic system of claim 11, wherein said active beam defines a bent current path extending between a pair of electrodes, said electrodes being connected to said control circuitry for controlling said actuator.

14. The microfluidic system of claim 11, wherein said thermoelastic material is selected from the group comprising:

titanium nitride, titanium aluminium nitride and vanadium-aluminium alloys.

15. The microfluidic system of claim 11, wherein said passive beam is comprised of a material selected from the group comprising:

silicon oxide, silicon nitride and silicon oxynitride.

16. The microfluidic system of claim 1, wherein said integrated circuit is in fluidic communication and/or mechanical communication with said polymeric microfluidics platform.

17. The microfluidic system of claim 1, which is a LOC device or a Micro Total Analysis System (μ

TAS).