SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
First Claim
1. A wiring substrate comprising:
- an organic resin layer and a fibrous body, the fibrous body being impregnated with the organic resin layer, anda wiring penetrating a portion of the fibrous body and portions of upper and lower surfaces of the organic resin layer, the portion of the fibrous body being impregnated with the wiring,wherein the portion of the fibrous body is positioned in the wiring.
1 Assignment
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Accused Products
Abstract
To form a conductive region in a prepreg without opening a through hole in a fibrous body. A wiring substrate is provided, including: an organic resin layer and a fibrous body, wherein the fibrous body is impregnated with the organic resin layer; and a wiring with which the fibrous body is impregnated and which is formed by dissolving the organic resin layer. The wiring is exposed on both surfaces of the organic resin layer and penetrates the fibrous body so that the fibrous body is positioned in the through wiring. Further, a semiconductor device is provided by adhering an integrated circuit chip having a bump to the wiring substrate so that the bump is in contact with the wiring.
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Citations
16 Claims
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1. A wiring substrate comprising:
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an organic resin layer and a fibrous body, the fibrous body being impregnated with the organic resin layer, and a wiring penetrating a portion of the fibrous body and portions of upper and lower surfaces of the organic resin layer, the portion of the fibrous body being impregnated with the wiring, wherein the portion of the fibrous body is positioned in the wiring. - View Dependent Claims (2, 3, 4)
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5. A semiconductor device comprising:
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an integrated circuit chip having a first wiring; an organic resin layer and a fibrous body, the fibrous body being impregnated with the organic resin layer, and a second wiring penetrating a portion of the fibrous body and portions of upper and lower surfaces of the organic resin layer, the portion of the fibrous body being impregnated with the second wiring, wherein the first wiring is in contact with the second wiring. - View Dependent Claims (6, 7, 8)
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9. A manufacturing method of a wiring substrate, comprising the steps of:
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impregnating a fibrous body with an organic resin layer; and forming a wiring by provision of a conductive resin including metal particles over a portion of the organic resin layer, dissolution of the organic resin layer by the conductive resin, and penetration of the metal particles through the fibrous body. - View Dependent Claims (10, 11, 12)
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13. A manufacturing method of a semiconductor device, comprising the steps of:
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forming an integrated circuit chip having a first wiring; impregnating a fibrous body with an organic resin layer; adhering the integrated circuit chip to the organic resin layer and the fibrous body; and forming a second wiring which is in contact with the first wiring by provision of a conductive resin including metal particles over a portion of the organic resin layer, dissolution of the organic resin layer by the conductive resin, and penetration of the metal particles through the fibrous body. - View Dependent Claims (14, 15, 16)
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Specification