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WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD

  • US 20090314528A1
  • Filed: 06/17/2009
  • Published: 12/24/2009
  • Est. Priority Date: 06/24/2008
  • Status: Active Grant
First Claim
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1. A wiring board that has a single layer or a plurality of layers, comprising:

  • a first wiring pattern that includes electrically conductive nanoparticles as a principal material and is formed in a soluble porous membrane member of any single layer; and

    a second wiring pattern that does not include the electrically conductive nanoparticles as a principal material.

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