Bonded Microfluidic System Comprising Thermal Bend Actuated Valve

• US 20090315126A1
• Filed: 06/20/2008
• Published: 12/24/2009
• Est. Priority Date: 06/20/2008
• Status: Abandoned Application

• Current Assignee: Silverbrook Research Pty Limited
• Original Assignee: Silverbrook Research Pty Limited
• Inventors: Silverbrook, Kia, Kerr, Emma Rose, McAvoy, Gregory John
• Application Number:
  US12/142,793
• Publication Number:
  US 20090315126A1
• Time in Patent Office: Days
• US Class Current: 257/415
• CPC Class Codes: B01L 2200/10 Integrating sample preparation and analysis in single entity, e.g. lab-on-a-chip concept
• CPC Class Codes: B01L 2200/12 Specific details about manufacturing devices
• CPC Class Codes: B01L 2300/123 Flexible; Elastomeric
• CPC Class Codes: B01L 2300/14 Means for pressure control
• CPC Class Codes: B01L 2400/0481 squeezing of channels or chambers
• CPC Class Codes: B01L 2400/0655 pinch valves
• CPC Class Codes: B01L 3/502738 characterised by integrated valves microvalves F16K99/0001
• CPC Class Codes: C08L 2201/12 Shape memory
• CPC Class Codes: F04B 19/006 Micropumps F04B43/043 and F04B43/095 take precedence
• CPC Class Codes: F16K 2099/0084 Chemistry or biology, e.g. "lab-on-a-chip" technology
• CPC Class Codes: F16K 99/0001 Microvalves microdevices B81B1/00; manufacture or treatment of devices or systems in or on a substrate B81C1/00; microfluidic structures B01L3/5027; micropumps F04B19/006
• CPC Class Codes: F16K 99/0007 of cantilever type
• CPC Class Codes: F16K 99/0038 using shape memory alloys

Abstract

A microfluidic system comprising a MEMS integrated circuit bonded to a microfluidics platform. The microfluidics platform comprises a polymeric body having at least one microfluidic channel defined therein. The MEMS integrated circuit comprises at least one thermal bend actuator. The microfluidic system is configured such that movement of the actuator causes closure of the channel.

Claims

1. A microfluidic system comprising a MEMS integrated circuit bonded to a microfluidics platform, said microfluidics platform comprising a polymeric body having at least one microfluidic channel defined therein, and said MEMS integrated circuit comprising at least one thermal bend actuator, wherein said microfluidic system is configured such that movement of said at least one actuator causes closure of said channel.

2. The microfluidic system of claim 1, wherein said at least one thermal bend actuator is associated with a respective moveable finger such that actuation of said thermal bend actuator causes movement of said respective finger.

3. The microfluidic system of claim 2, wherein said finger is engaged with a wall of said microfluidic channel.

4. The microfluidic system of claim 3, which is configured such that movement of said finger towards said microfluidics platform causes closure of said channel by pinching said wall against an opposed wall.

5. The microfluidic system of claim 4, wherein said movement is provided by deactuation of said thermal bend actuator.

6. The microfluidic system of claim 2 comprising a plurality of moveable fingers configured as a linear peristaltic pump.

7. The microfluidic system of claim 6, wherein said pump is in fluidic communication with a control channel defined in said polymeric body, said control channel cooperating with said microfluidic channel such that pressurizing said control channel with a control fluid causes pinching closure of said microfluidic channel.

8. The microfluidic system of claim 7, wherein said control fluid is a gas providing pneumatic control, or a liquid providing hydraulic control.

9. The microfluidic system of claim 1, wherein said at least one thermal bend actuator is positioned in a MEMS layer of said MEMS integrated circuit.

10. The microfluidic system of claim 9, wherein said MEMS integrated circuit comprises a silicon substrate and said MEMS layer is formed on said substrate.

11. The microfluidic system of claim 10, wherein said MEMS integrated circuit comprises control circuitry for controlling said at least one thermal bend actuator, said control circuitry being contained in at least one CMOS layer of said substrate.

12. The microfluidic system of claim 9, wherein said MEMS layer is covered with a polymeric layer.

13. The microfluidic system of claim 12, wherein said polymeric layer defines a bonding surface of said MEMS integrated circuit.

14. The microfluidic system of claim 12, wherein said polymeric layer is comprised of photopatternable PDMS.

15. The microfluidic system of claim 1, wherein said polymeric body is comprised of PDMS.

16. The microfluidic system of claim 11, wherein said thermal bend actuator comprises:

an active beam comprised of a thermoelastic material; and

a passive beam mechanically cooperating with said active beam, such that when a current is passed through the active beam, the active beam heats and expands relative to the passive beam, resulting in bending of the actuator.

17. The microfluidic system of claim 16, wherein said active beam is fused to said passive beam.

18. The microfluidic system of claim 16, wherein said active beam defines a bent current path extending between a pair of electrodes, said electrodes being connected to control circuitry for controlling said actuator.

19. The microfluidic system of claim 13, wherein said thermoelastic material is selected from the group comprising:

titanium nitride, titanium aluminium nitride and vanadium-aluminium alloys; and

said passive beam is comprised of a material selected from the group comprising;

silicon oxide, silicon nitride and silicon oxynitride.

20. The microfluidic system of claim 1, which is a LOC device or a Micro Total Analysis System (μ

TAS).