METHOD OF FORMING A DEVICE WAFER WITH RECYCLABLE SUPPORT
First Claim
1. A semiconductor construct comprising:
- a wafer having first and second surfaces, with at least the first surface of the wafer comprising a semiconductor material that is suitable for receiving or forming electronic devices thereon;
a supporting substrate having upper and lower surfaces, with the upper surface of the supporting substrate having a plurality of holes extending therethrough;
a connecting bond present at an interface between the wafer and the substrate which is suitable to maintain the wafer and supporting substrate in association while forming or applying electronic devices to the first surface of the wafer, but which connecting bond is severable at the interface;
wherein the plurality of holes are configured to receive at least one loosening agent therethrough for weakening the connecting bond between the wafer and the substrate at the interface.
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Abstract
A method for forming a device wafer with a recyclable support by providing a wafer having first and second surfaces, with at least the first surface of the wafer comprising a semiconductor material that is suitable for receiving or forming electronic devices thereon, providing a supporting substrate having upper and lower surfaces, and providing the second surface of the wafer or the upper surface of the supporting substrate with void features in an amount sufficient to enable a connecting bond therebetween to form a construct wherein the bond is formed at an interface between the wafer and the substrate and is suitable to maintain the wafer and supporting substrate in association while forming or applying electronic devices to the first surface of the wafer, but which connecting bond is severable at the interface due to the void features to separate the substrate from the wafer so that the substrate can be reused.
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Citations
8 Claims
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1. A semiconductor construct comprising:
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a wafer having first and second surfaces, with at least the first surface of the wafer comprising a semiconductor material that is suitable for receiving or forming electronic devices thereon; a supporting substrate having upper and lower surfaces, with the upper surface of the supporting substrate having a plurality of holes extending therethrough; a connecting bond present at an interface between the wafer and the substrate which is suitable to maintain the wafer and supporting substrate in association while forming or applying electronic devices to the first surface of the wafer, but which connecting bond is severable at the interface; wherein the plurality of holes are configured to receive at least one loosening agent therethrough for weakening the connecting bond between the wafer and the substrate at the interface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification