INLAYS FOR SECURITY DOCUMENTS

• US 20090315320A1
• Filed: 08/22/2009
• Published: 12/24/2009
• Est. Priority Date: 09/26/2006
• Status: Active Grant

• Current Assignee: Assa Abloy AB, AmaTech Group Limited (Paragon Group Limited)
• Original Assignee: ADVANCED MICROELECTRONIC AND AUTOMATION TECHNOLOGY LTD.
• Inventors: Finn, David
• Granted Patent: US 8,608,080 B2
• Time in Patent Office: Days
• US Class Current: 283/107
• CPC Class Codes: B32B 2037/1269 multi-component adhesive
• CPC Class Codes: B32B 2305/342 Chips
• CPC Class Codes: B32B 2425/00 Cards, e.g. identity cards, credit cards
• CPC Class Codes: B32B 37/1207 Heat-activated adhesive B32B37/04 takes precedence
• CPC Class Codes: B32B 38/10 Removing layers, or parts of layers, mechanically or chemically
• CPC Class Codes: B42D 15/00 Printed matter of special format or style not otherwise provided for
• CPC Class Codes: G06K 19/025 the material being flexible or adapted for folding, e.g. paper or paper-like materials used in luggage labels, identification tags, forms or identification documents carrying RFIDs methods for testing the genuineness of valuable papers, e.g. banknotes or passports G07D7/00; constructional features of booklets and the like B42D
• CPC Class Codes: G06K 19/0672 with resonating marks
• CPC Class Codes: G06K 19/07318 by hindering electromagnetic reading or writing jamming of communication, counter-measures H04K3/00; secret communication H04K1/00
• CPC Class Codes: G06K 19/07327 Passive means, e.g. Faraday cages Faraday-type protection of electric circuits in general H05K9/00
• CPC Class Codes: G06K 19/07722 the record carrier being multilayered, e.g. laminated sheets flat articles in general, see B32B37/00
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45 of an individual wire connector
• CPC Class Codes: H01L 2224/45014 Ribbon connectors, e.g. rectangular cross-section
• CPC Class Codes: H01L 2224/45015 : being circular
• CPC Class Codes: H01L 2224/45124 : Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45139 : Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/45144 : Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 : Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/45565 : Single coating layer
• CPC Class Codes: H01L 2224/45639 : Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/48091 : Arched
• CPC Class Codes: H01L 2224/48227 : connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85 : using a wire connector
• CPC Class Codes: H01L 2224/85203 : Thermocompression bonding
• CPC Class Codes: H01L 2224/85205 : Ultrasonic bonding
• CPC Class Codes: H01L 2224/85399 : Material
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/85 : using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/20752 : larger or equal to 20 microns less than 30 microns
• CPC Class Codes: H01L 2924/20756 : larger or equal to 60 microns less than 70 microns
• CPC Class Codes: H01L 2924/20757 : larger or equal to 70 microns less than 80 microns
• CPC Class Codes: H01L 2924/20758 : larger or equal to 80 microns less than 90 microns
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01Q 1/2225 : used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 : formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/40 : Radiating elements coated with or embedded in protective material
• CPC Class Codes: H01Q 7/00 : Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: Y10T 156/10 : Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 156/1002 : with permanent bending or reshaping or surface deformation of self sustaining lamina
• CPC Class Codes: Y10T 156/1082 : Partial cutting bonded sandwich [e.g., grooving or incising]

Abstract

Secure inlays for secure documents such as a passport comprising an inlay substrate may have laser ablated recesses within which a chip module is installed. Channels for an antenna wire may be formed in a surface of the substrate. Instead of using wire, the channels may be filled with a flowable, conductive material. Patches homogenous with the substrate layer may be used to protect and seal the chip and interconnection area. The inlay substrate may include two layers, and the antenna wire may be between the two layers. A moisture-curing polyurethane hot melt adhesive may be used to laminate a cover layer and the additional inlay substrate layers. The adhesive layer may include metal nanoscale powder and ink for electromagnetic shielding. Additional security elements may include material that is optically changeable by an electromagnetic field. Ferrite-containing layers may be incorporated in the inlay substrate.

Claims

1. An inlay substrate for a secure document having a recess extending into the inlay substrate from a first (top) surface thereof for receiving a chip module therein, and an antenna wire disposed in the inlay substrate and connected with the chip module, the inlay substrate comprising:

at least two layers of a synthetic material, such as Teslin™

, laminated to one another with a layer of adhesive.

2. The inlay substrate of claim 1, wherein:

the antenna wire is disposed between the at least two layers.

3. The inlay substrate of claim 1, wherein:

the recess is stepped, and is formed by a first opening having a first width dimension in a first one of the at least two layers, and a second opening having a second width dimension in a second one of the at least two layers which is adjacent to the first one of the at least two layers and the second opening is aligned with the first opening; and

the first width dimension is different than the second width dimension.

4. The inlay substrate of claim 1, wherein:

the recess is a pocket-type recess extending only partially through the inlay substrate or a window-type recess extending completely through the inlay substrate.

5. The inlay substrate of claim 1, further comprising:

a moisture-resistant patch covering the chip module.

6. The inlay substrate of claim 1, further comprising:

an epoxy filling disposed in the recess, surrounding the chip module and the antenna wire interconnections.

7. The inlay substrate of claim 1, further comprising:

pre-formed channels in a surface of the substrate within which the antenna wire is at least partially embedded.

8. The inlay substrate of claim 1, wherein:

the chip module is a leadframe-type module or an epoxy glass type module.

9. The inlay substrate of claim 1, further comprising:

at least one lid covering at least one opening of the recess.

10. The inlay substrate of claim 1, further comprising:

a cover layer laminated to the inlay substrate.

11. The inlay substrate of claim 10, wherein:

the cover layer and inlay substrate comprise an inlay, such as for a passport booklet (cover) having a front panel and a back panel.

12. The inlay substrate of claim 11, further comprising:

a shielding/detuning antenna disposed on the back panel of the passport cover.

13. The inlay substrate of claim 11, further comprising:

a switch disposed in the passport cover for disconnecting the chip module'"'"'s antenna when the passport booklet is closed.

14. A method of making a secure document comprising an inlay substrate, a chip module disposed in a recess extending into a surface of the inlay substrate, and an antenna wire mounted to the inlay substrate and connected with the chip module, comprising:

providing the inlay substrate as at least two layers of a synthetic material, such as Teslin™

, laminated to one another with a layer of adhesive.

15. The method of claim 14, wherein mounting the antenna wire comprises:

disposing the antenna wire between the at least two layers.

16. The method of claim 14, further comprising:

forming the recess as a stepped recess having a first opening having a first width dimension in a first one of the at least two layers, and a second opening having a second width dimension in a second one of the at least two layers which is adjacent to the first one of the at least two layers and the second opening is aligned with the first opening.

17. The method of claim 18, further comprising:

forming the recess as a pocket-type recess extending only partially through the substrate or a window-type recess extending completely through the inlay substrate.

18. The method of claim 14, further comprising:

forming the recess by laser ablation.

19. The method of claim 14, further comprising:

forming channels in a surface of the substrate within which the antenna wire may be at least partially embedded.

20. The method of claim 19, wherein:

the channels are formed by removing material or displacing material.

21. The method of claim 19, wherein:

the channels are formed by at least one of laser ablation, gouging, ultrasonic stamping, and heating and molding.

22. A method of making an inlay for a security document comprising an inlay substrate, a chip module disposed in a recess extending into a surface of the inlay substrate, and an antenna wire mounted to the inlay substrate and connected with the chip module, comprising:

forming the recess by laser ablation.

23. The method of claim 22 further comprising:

forming channels in a surface of the substrate, by laser ablation, within which the antenna wire may be at least partially embedded.

24. A method of making an inlay for a security document comprising an inlay substrate, a chip module disposed in a recess extending into a surface of the inlay substrate, and an antenna wire mounted to the inlay substrate and connected with the chip module, comprising:

forming channels in a surface of the substrate within which the antenna wire may be at least partially embedded;

wherein the channels are formed by removing material or displacing material; and

wherein the channels are formed by at least one of laser ablation, gouging, ultrasonic stamp, and heating and molding.