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INLAYS FOR SECURITY DOCUMENTS

  • US 20090315320A1
  • Filed: 08/22/2009
  • Published: 12/24/2009
  • Est. Priority Date: 09/26/2006
  • Status: Active Grant
First Claim
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1. An inlay substrate for a secure document having a recess extending into the inlay substrate from a first (top) surface thereof for receiving a chip module therein, and an antenna wire disposed in the inlay substrate and connected with the chip module, the inlay substrate comprising:

  • at least two layers of a synthetic material, such as Teslin™

    , laminated to one another with a layer of adhesive.

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  • 5 Assignments
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