METHOD AND SYSTEM FOR INTER-CHIP COMMUNICATION VIA INTEGRATED CIRCUIT PACKAGE ANTENNAS

• US 20090315797A1
• Filed: 08/14/2008
• Published: 12/24/2009
• Est. Priority Date: 06/19/2008
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Rofougaran, Maryam, Rofougaran, Ahmadreza
• Granted Patent: US 8,384,596 B2
• Time in Patent Office: Days
• US Class Current: 343/787
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/15321 being a ball array, e.g. BGA
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 9/0407 Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40

Abstract

Methods and systems for inter-chip communication via integrated circuit package antennas are disclosed and may include communicating one or more signals between or among a plurality of integrated circuits via one or more antennas integrated in a multi-layer package. The integrated circuits may be bonded to the multi-layer package. The antennas may be configured via switches in the integrated circuits or by MEMS switches integrated in the multi-layer package. The signals may include a microwave signal and a low frequency control signal that may configure the microwave signal. The low frequency control signal may include a digital signal. The antennas may comprise metal and/or ferromagnetic layers deposited on and/or embedded within the multi-layer package.

Claims

1. A method for wireless communication, the method comprising:

communicating one or more signals between or among a plurality of integrated circuits via one or more antennas integrated in a multi-layer package, wherein said integrated circuits are bonded to said multi-layer package.

2. The method according to claim 1, comprising configuring said one or more antennas via switches integrated within each of said plurality of integrated circuits.

3. The method according to claim 1, comprising configuring said one or more antennas via MEMS switches integrated in said multi-layer package.

4. The method according to claim 1, wherein said one or more signals comprises a microwave signal.

5. The method according to claim 1, comprising configuring said communication of said one or more signals via a low frequency control signal.

6. The method according to claim 5, wherein said low frequency control signal comprises a digital signal.

7. The method according to claim 1, wherein said one or more antennas comprise metal layers deposited on said multi-layer package.

8. The method according to claim 1, wherein said one or more antennas comprise metal layers embedded within said multi-layer package.

9. The method according to claim 1, wherein said one or more antennas comprise ferromagnetic layers deposited on said multi-layer package.

10. The method according to claim 1, wherein said one or more antennas comprise ferromagnetic layers embedded within said multi-layer package.

11. A system for wireless communication, the system comprising:

one or more circuits in each of a plurality of integrated circuits bonded to a multilayer package, wherein said one or more circuits enables communication of one or more signals between or among each of said plurality of integrated circuits via one or more antennas integrated in said multi-layer package.

12. The system according to claim 11, wherein said one or more circuits enables configuration of said one or more waveguides via switches integrated within each of said plurality of integrated circuits.

13. The system according to claim 11, wherein said one or more circuits enables configuration of said one or more antennas via MEMS switches integrated in said multi-layer package.

14. The system according to claim 11, wherein said one or more signals comprises a microwave signal.

15. The system according to claim 11, wherein said one or more circuits enables configuration of said communication of said one or more signals via a low frequency control signal.

16. The system according to claim 15, wherein said low frequency control signal comprises a digital signal.

17. The system according to claim 11, wherein said one or more antennas comprise metal layers deposited on said multi-layer package.

18. The system according to claim 11, wherein said one or more antennas comprise metal layers embedded within said multi-layer package.

19. The system according to claim 11, wherein said one or more waveguides comprise ferromagnetic layers deposited on said multi-layer package.

20. The system according to claim 11, wherein said one or more antennas comprise ferromagnetic layers embedded within said multi-layer package.