Bonded Microfluidics System Comprising MEMS-Actuated Microfluidic Devices

• US 20090317301A1
• Filed: 06/20/2008
• Published: 12/24/2009
• Est. Priority Date: 06/20/2008
• Status: Abandoned Application

• Current Assignee: Silverbrook Research Pty Limited
• Original Assignee: Silverbrook Research Pty Limited
• Inventors: Silverbrook, Kia, McAvoy, Gregory John
• Application Number:
  US12/142,782
• Publication Number:
  US 20090317301A1
• Time in Patent Office: Days
• US Class Current: 422/100
• CPC Class Codes: B01L 2300/123 Flexible; Elastomeric
• CPC Class Codes: B01L 2400/0481 squeezing of channels or chambers
• CPC Class Codes: B01L 2400/0484 Cantilevers
• CPC Class Codes: B01L 2400/0655 pinch valves
• CPC Class Codes: B01L 3/0268 using pulse dispensing or spraying, eg. inkjet type, piezo actuated ejection of droplets from capillaries
• CPC Class Codes: B01L 3/50273 characterised by the means or forces applied to move the fluids micropumps F04B19/006, of the membrane type F04B43/043
• CPC Class Codes: B41J 2/14427 Structure of ink jet print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1645 thin film formation by spincoating
• CPC Class Codes: F04B 19/006 Micropumps F04B43/043 and F04B43/095 take precedence

Abstract

A microfluidic system comprising a MEMS integrated circuit bonded to a polymeric microfluidics platform. The system comprises one or more microfluidic devices. At least one of the microfluidic devices comprises a MEMS actuator positioned in a MEMS layer of the integrated circuit.

Claims

1. A microfluidic system comprising a MEMS integrated circuit bonded to a polymeric microfluidics platform, said system comprising one or more microfluidic devices, wherein at least one of said microfluidic devices comprises a MEMS actuator positioned in a MEMS layer of said integrated circuit.

2. The microfluidic system of claim 1, wherein said microfluidic devices are selected from the group comprising:

microfluidic valves and microfluidic pumps.

3. The microfluidic system of claim 1, wherein all of said microfluidic devices comprise a MEMS actuator positioned in said MEMS layer.

4. The microfluidic system of claim 1, wherein said MEMS layer further comprises a microheater for heating a fluid in a microfluidic channel.

5. The microfluidic system of claim 1, wherein said MEMS integrated circuit comprises a silicon substrate and said MEMS layer is formed on said substrate.

6. The microfluidic system of claim 1, wherein said MEMS layer is covered with a polymeric layer.

7. The microfluidic system of claim 6, wherein said polymeric layer defines a bonding surface of said MEMS integrated circuit.

8. The microfluidic system of claim 6, wherein said polymeric layer is comprised of photopatternable PDMS.

9. The microfluidic system of claim 1, wherein said microfluidics platform comprises a polymeric body having one or more microfluidic channels defined therein.

10. The microfluidic system of claim 9, wherein said polymeric body is comprised of PDMS.

11. The microfluidic system of claim 9, wherein at least one of said microfluidic channels is in fluid communication with said at least one microfluidic device.

12. The microfluidic system of claim 1, wherein said MEMS integrated circuit comprises control circuitry for controlling said actuator, said control circuitry being contained in at least one CMOS layer of said substrate.

13. The microfluidic system of claim 1, wherein said MEMS actuator is a thermal bend actuator.

14. The microfluidic system of claim 13, wherein said thermal bend actuator comprises:

an active beam comprised of a thermoelastic material; and

a passive beam mechanically cooperating with said active beam, such that when a current is passed through the active beam, the active beam heats and expands relative to the passive beam, resulting in bending of the actuator.

15. The microfluidic system of claim 14, wherein said active beam is fused to said passive beam.

16. The microfluidic system of claim 14, wherein said active beam defines a bent current path extending between a pair of electrodes, said electrodes being connected to control circuitry for controlling said actuator.

17. The microfluidic system of claim 14, wherein said thermoelastic material is selected from the group comprising:

titanium nitride, titanium aluminium nitride and vanadium-aluminium alloys.

18. The microfluidic system of claim 13, wherein said passive beam is comprised of a material selected from the group comprising:

silicon oxide, silicon nitride and silicon oxynitride.

19. The microfluidic system of claim 1, which is a LOC device or a Micro Total Analysis System (μ

TAS).