Microfluidic System Comprising MEMS Integrated Circuit

• US 20090317302A1
• Filed: 06/20/2008
• Published: 12/24/2009
• Est. Priority Date: 06/20/2008
• Status: Abandoned Application

• Current Assignee: Silverbrook Research Pty Limited
• Original Assignee: Silverbrook Research Pty Limited
• Inventors: Silverbrook, Kia, Kerr, Emma Rose, McAvoy, Gregory John
• Application Number:
  US12/142,784
• Publication Number:
  US 20090317302A1
• Time in Patent Office: Days
• US Class Current: 422/100
• CPC Class Codes: B01L 2200/10 Integrating sample preparation and analysis in single entity, e.g. lab-on-a-chip concept
• CPC Class Codes: B01L 2200/12 Specific details about manufacturing devices
• CPC Class Codes: B01L 2300/087 Multiple sequential chambers
• CPC Class Codes: B01L 2300/0874 Three dimensional network
• CPC Class Codes: B01L 2300/0887 Laminated structure
• CPC Class Codes: B01L 2300/14 Means for pressure control
• CPC Class Codes: B01L 2400/0481 squeezing of channels or chambers
• CPC Class Codes: B01L 2400/0655 pinch valves
• CPC Class Codes: B01L 2400/082 Active control of flow resistance, e.g. flow controllers
• CPC Class Codes: B01L 3/502707 characterised by the manufacture of the container or its components by shaping or joining plastic parts B29C59/00, B29C65/00; by laminating B32B37/00; manufacture of microstructural devices in general B81C
• CPC Class Codes: B01L 3/50273 characterised by the means or forces applied to move the fluids micropumps F04B19/006, of the membrane type F04B43/043
• CPC Class Codes: B01L 3/502738 characterised by integrated valves microvalves F16K99/0001
• CPC Class Codes: B41J 2/14427 Structure of ink jet print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1645 thin film formation by spincoating
• CPC Class Codes: C08L 2201/12 Shape memory
• CPC Class Codes: F04B 19/006 Micropumps F04B43/043 and F04B43/095 take precedence
• CPC Class Codes: F04B 43/043 Micropumps
• CPC Class Codes: F04B 43/14 having plate-like flexible members
• CPC Class Codes: F16K 2099/0084 : Chemistry or biology, e.g. "lab-on-a-chip" technology
• CPC Class Codes: F16K 99/0001 : Microvalves microdevices B81B1/00; manufacture or treatment of devices or systems in or on a substrate B81C1/00; microfluidic structures B01L3/5027; micropumps F04B19/006
• CPC Class Codes: F16K 99/0007 : of cantilever type
• CPC Class Codes: F16K 99/0038 : using shape memory alloys
• CPC Class Codes: Y10T 137/0318 : Processes
• CPC Class Codes: Y10T 137/0396 : Involving pressure control
• CPC Class Codes: Y10T 137/2213 : Electrically-actuated element [e.g., electro-mechanical transducer]

Abstract

A microfluidic system comprising a MEMS integrated circuit. The MEMS integrated circuit comprises: a silicon substrate having one or more microfluidic channels defined therein; at least one layer of control circuitry for controlling one or more microfluidic devices; a MEMS layer comprising the microfluidic devices; and a polymeric layer covering the MEMS layer. Part of the polymeric layer provides a seal for the microfluidic devices.

Claims

1. A microfluidic system comprising a MEMS integrated circuit, said MEMS integrated circuit comprising:

a silicon substrate having one or more microfluidic channels defined therein;

at least one layer of control circuitry for controlling one or more microfluidic devices;

a MEMS layer comprising said one or more microfluidic devices; and

a polymeric layer covering said MEMS layer,

wherein at least part of said polymeric layer provides a seal for at least one of said microfluidic devices.

2. The microfluidic system of claim 1, wherein said MEMS integrated circuit contains all the microfluidic devices and control circuitry required for operation of said microfluidic system.

3. The microfluidic system of claim 1, wherein said microfluidic devices are selected from the group comprising:

microfluidic valves and microfluidic pumps.

4. The microfluidic system of claim 1, wherein said control circuitry is contained in at least one CMOS layer.

5. The microfluidic system of claim 1, wherein said polymeric layer is comprised of photopatternable PDMS.

6. The microfluidic system of claim 1, wherein said polymeric layer defines an exterior surface of said MEMS integrated circuit.

7. The microfluidic system of claim 1, wherein MEMS integrated circuit is mounted on a passive substrate via said polymeric layer.

8. The microfluidic system of claim 1, wherein said at least one microfluidic device comprises a MEMS actuator.

9. The microfluidic system of claim 8, wherein said MEMS actuator is a thermal bend actuator.

10. The microfluidic system of claim 9, wherein said thermal bend actuator comprises:

an active beam comprised of a thermoelastic material; and

a passive beam mechanically cooperating with said active beam, such that when a current is passed through the active beam, the active beam heats and expands relative to the passive beam, resulting in bending of the actuator.

11. The microfluidic system of claim 10, wherein said active beam is fused to said passive beam.

12. The microfluidic system of claim 10, wherein said active beam defines a bent current path extending between a pair of electrodes, said electrodes being connected to said control circuitry for controlling said actuator.

13. The microfluidic system of claim 10, wherein said thermoelastic material is selected from the group comprising:

titanium nitride, titanium aluminium nitride and vanadium-aluminium alloys.

14. The microfluidic system of claim 10, wherein said passive beam is comprised of a material selected from the group comprising:

silicon oxide, silicon nitride and silicon oxynitride.

15. The microfluidic system of claim 1, wherein said microfluidic device is a microfluidic valve comprising a sealing surface positioned between an inlet port and an outlet ports, and wherein said at least part of said polymeric layer is configured for sealing engagement with said sealing surface.

16. The microfluidic system of claim 1, wherein said sealing engagement regulates fluid flow from said inlet port to said outlet port.

17. The microfluidic system of claim 1, wherein said microfluidic device is a microfluidic peristaltic pump comprising:

a pumping chamber positioned between an inlet and an outlet; and

a plurality of moveable fingers positioned in a wall of said pumping chamber, said fingers being arranged in a row along said wall and configured to provide a peristaltic pumping action via movement of said fingers,

wherein said at least part of said polymeric layer provides a mechanical seal between each moveable finger and said wall.

18. The microfluidic system of claim 1, which is a LOC device Micro Total Analysis System (μ

TAS).