Arrangement for Energy Conditioning

• US 20090321127A1
• Filed: 09/07/2009
• Published: 12/31/2009
• Est. Priority Date: 04/08/1997
• Status: Active Grant

• Current Assignee: X2Y Attenuators, LLC
• Original Assignee: X2Y Attenuators, LLC
• Inventors: Anthony, William M., ANTHONY, Anthony A.
• Granted Patent: US 7,768,763 B2
• Time in Patent Office: Days
• US Class Current: 174/350
• CPC Class Codes: H01G 4/40 Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/585 comprising conductive layers or plates or strips or rods or rings H01L23/60, H01L23/62, H01L23/64, H01L23/66 take precedence
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H03H 2001/0014 Capacitor filters, i.e. capacitors whose parasitic inductance is of relevance to consider it as filter
• CPC Class Codes: H03H 2001/0085 : Multilayer, e.g. LTCC, HTCC, green sheets inside PCB filters H05K
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing

Abstract

Circuit arrangement embodiments that use relative groupings of energy pathways that include shielding circuit arrangements that can sustain and condition electrically complementary energy confluences.

Claims

1-31. -31. (canceled)

32. An energy pathway arrangement comprising:

an integrated circuit wafer;

a first plurality of shielding pathways that are conductively coupled to one another;

a second plurality of shielding pathways that are conductively coupled to one another;

a first plurality of shielded energy pathways;

a second plurality of shielded energy pathways;

wherein at least one shielded energy pathway of the first plurality of shielded energy pathways is conductively coupled to a first portion of the integrated circuit wafer;

wherein at least one shielded energy pathway of the second plurality of shielded energy pathways is conductively coupled to a second portion of the integrated circuit wafer; and

wherein the first plurality of shielded energy pathways is conductively isolated from the first plurality of shielding pathways.

33. The energy pathway arrangement of claim 32, wherein the energy pathway arrangement is operable as a capacitor when the integrated circuit wafer is energized.