SYSTEMS AND METHODS FOR REDUCED STRESS ANCHORS

• US 20090321857A1
• Filed: 06/25/2008
• Published: 12/31/2009
• Est. Priority Date: 06/25/2008
• Status: Active Grant

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Williams, Mark, Eskridge, Mark, Foster, Michael
• Granted Patent: US 8,039,912 B2
• Time in Patent Office: Days
• US Class Current: 257/415
• CPC Class Codes: B81B 1/00 Devices without movable or flexible elements, e.g. microcapillary devices
• CPC Class Codes: B81B 2201/0242 Gyroscopes
• CPC Class Codes: B81B 2203/0307 Anchors
• CPC Class Codes: B81B 2207/07 Interconnects
• CPC Class Codes: B81C 1/00039 Anchors
• CPC Class Codes: G01C 19/5719 using planar vibrating masses driven in a translation vibration along an axis
• CPC Class Codes: H01L 29/84 controllable by variation of applied mechanical force, e.g. of pressure

Abstract

Anchor systems and methods anchor components of a Micro-Electro-Mechanical Systems (MEMS) device to a substrate. An exemplary embodiment has a trace anchor bonded to a substrate, a device anchor bonded to the substrate, and an anchor flexure configured flexibly couple the trace anchor and the device anchor to substantially prevent transmission of a stress induced in the trace anchor from being transmitted to the device anchor.

Claims

1. A method of anchoring a Micro-Electro-Mechanical Systems (MEMS) device to a substrate, the method comprising:

bonding a trace anchor of the MEMS device to a trace anchor mesa of the substrate, wherein at least one of a trace and a bump induce a stress into the trace anchor; and

bonding a device anchor of the MEMS device to a device anchor mesa of the substrate, wherein the device anchor is flexibly coupled to the trace anchor by an anchor flexure that substantially prevents transmission of the stress induced in the trace anchor to the device anchor.

2. The method of claim 1, wherein prior to bonding, the method further comprises:

forming the trace anchor mesa and the device anchor mesa on the substrate so as to form a void region in the substrate adjacent to a location of the anchor flexure, wherein the bonding does not bond the anchor flexure to the substrate.

3. The method of claim 1, wherein prior to bonding, the method further comprises:

forming a void region in the anchor flexure adjacent to a location of the substrate, wherein the bonding does not bond the anchor flexure to the substrate.

4. The method of claim 1, wherein the anchor flexure electrically couples the trace anchor and the device anchor.

5. A Micro-Electro-Mechanical Systems (MEMS) device anchor system, comprising:

a trace anchor bonded to a substrate;

a device anchor bonded to the substrate; and

an anchor flexure configured to flexibly couple the trace anchor and the device anchor to substantially prevent transmission of a stress induced in the trace anchor from being transmitted to the device anchor.

6. The anchor system of claim 5, further comprising:

a trace anchor mesa on the substrate, wherein the trace anchor is bonded to the trace anchor mesa, and wherein the bonding induces the stress in the trace anchor.

7. The anchor system of claim 6, further comprising:

a trace on the trace anchor mesa, wherein the trace is disposed between the trace anchor mesa and the trace anchor, and wherein the trace further induces the stress into the trace anchor in response to the bonding of the trace anchor to the trace anchor mesa.

8. The anchor system of claim 7, further comprising:

a bump on the trace, wherein the bump is disposed between the trace and the trace anchor, and wherein the bump further induces additional stress into the trace anchor in response to a bonding of the trace anchor to the trace anchor mesa.

9. The anchor system of claim 5, further comprising:

a device anchor mesa on the substrate, wherein the device anchor is bonded to the device anchor mesa.

10. The anchor system of claim 9, wherein a separation of the device anchor mesa from the trace anchor mesa forms a void region such that the anchor flexure is not bonded to the substrate.

11. The anchor system of claim 5, wherein the anchor flexure includes a void region formed thereon, the void region disposed adjacent to the substrate such that the anchor flexure is not bonded to the substrate.

12. The anchor system of claim 5, further comprising:

a flexure coupled between the device anchor and a MEMS mechanism, wherein movement of the MEMS mechanism generates forces that are transmitted to the device anchor via the flexure, and wherein the forces are not transmitted to the trace anchor via the anchor flexure.

14. The anchor system of claim 5, further comprising:

a means for coupling the device anchor and a MEMS mechanism, wherein movement of the MEMS mechanism generates forces that are transmitted to the device anchor via the means for coupling the device anchor and the MEMS mechanism, and wherein the forces are not transmitted to the trace anchor via the means for flexibly coupling the trace anchor and the device anchor.

13. An anchor system for a Micro-Electro-Mechanical Systems (MEMS) device to a substrate, comprising:

a trace anchor bonded to a a trace on a substrate, wherein the trace anchor is electrically coupled to the trace, and wherein the trace induces stress into the trace anchor in response to the bonding of the trace anchor to the substrate;

a device anchor bonded to the substrate; and

a means for flexibly coupling and electrically coupling the trace anchor and the device anchor to substantially prevent transmission of the stress induced in the trace anchor from being transmitted to the device anchor.