MICROELECTRONIC IMAGERS WITH STACKED LENS ASSEMBLIES AND PROCESSES FOR WAFER-LEVEL PACKAGING OF MICROELECTRONIC IMAGERS

• US 20090321861A1
• Filed: 06/26/2008
• Published: 12/31/2009
• Est. Priority Date: 06/26/2008
• Status: Abandoned Application

• Current Assignee: Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Original Assignee: Micron Technology, Inc.
• Inventors: Lake, Rick C., Boettiger, Ulrich C., Oliver, Steven D.
• Application Number:
  US12/147,421
• Publication Number:
  US 20090321861A1
• Time in Patent Office: Days
• US Class Current: 257/432
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/14632 Wafer-level processed structures
• CPC Class Codes: H01L 27/14634 Assemblies, i.e. Hybrid structures
• CPC Class Codes: H01L 27/14636 Interconnect structures
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 27/14687 Wafer level processing
• CPC Class Codes: H01L 27/1469 Assemblies, i.e. hybrid integration
• CPC Class Codes: H01L 2924/16235 Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/0232 Optical elements or arrangements associated with the device H01L31/0236 takes precedence; for photovoltaic cells H01L31/054; for photovoltaic modules H02S40/20
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

Microelectronic imagers including stacked lens assemblies and process for wafer-level packaging of microelectronic imagers. One embodiment of a method for manufacturing stacked lens assemblies for integrated imagers comprises attaching a first lens substrate to a base spacer, fixing an intermediate spacer to the first lens substrate, and mounting a second lens substrate to the intermediate spacer. In a specific embodiment, the first lens substrate can be a component of a first lens unit and the second lens substrate can be a component of a second lens unit. Additionally, the first and second lens substrates can have one or more lens elements, aperture layers and/or filters on the substrates as described above or in other combinations.

Claims

1. A wafer level imager assembly, comprising:

an imager substrate including a plurality of imager dies, wherein individual imager dies have an image sensor and a plurality of through substrate interconnects electrically coupled to the image sensor;

a plurality of stacked lens assemblies attached to the imager substrate over corresponding imager dies such that the stacked lens assemblies are spaced apart from each other by gaps, wherein individual stacked lens assemblies have a first lens unit including a first substrate, a base spacer between the first lens unit and the imager substrate, a second lens unit including a second substrate, and an intermediate spacer between the first lens unit and the second lens unit; and

an encapsulant disposed in the gaps between the stacked lens assemblies.

2. The wafer level imager assembly of claim 1 wherein the base spacer, the first substrate, the intermediate spacer, and the second substrate have a common coefficient of thermal expansion.

3. The wafer level imager assembly of claim 1 wherein:

the base spacer comprises glass and has an opening;

the first substrate comprises glass;

the first lens unit further comprises a first lens element on the first substrate;

the intermediate spacer comprises glass and has an aperture;

the second substrate comprises glass; and

the second lens unit further comprises a second lens element on the second substrate.

4. The wafer lever imager assembly of claim 3 wherein the first lens element comprises a first polymeric focal feature and the second lens element comprises a second polymeric focal feature.

5. A packaged integrated imager, comprising:

an imager die having a semiconductor substrate including a first side and a second

side, an image sensor at the first side, and a plurality of interconnects electrically coupled to the image sensor and extending to the second side of the substrate; and

a stacked lens assembly attached to the imager die, the stacked lens assembly comprising a plurality of substrates, lens elements on the substrates, and a plurality of spacers, wherein the substrates and the spacers have common coefficients of thermal expansion.

6. The packaged integrated imager of claim 5 wherein:

the stacked lens assembly comprises a first lens unit including a first substrate and a first lens element;

a base spacer separating the first lens unit from the semiconductor substrate;

a second lens unit including a second substrate and a second lens element; and

an intermediate spacer between the first and second lens units, and wherein the base spacer, the first substrate, the intermediate spacer, and the second substrate comprise glass.

7. The packaged integrated imager of claim 6 wherein the first lens unit further comprises a first focal feature having a first polymeric member on the first glass substrate and the second lens unit further comprises a second focal feature having a second polymeric member on the second glass substrate.

8. The packaged integrated imager of claim 5, further comprising a polymeric encapsulant covering exterior sides of the stacked lens assembly.

9. The packaged integrated imager of claim 8 wherein the polymeric encapsulant comprises a material that is opaque to the radiation sensed by the image sensor.

10. A wafer level stacked lens assembly, comprising:

a base spacer having a plurality of apertures arranged in a lens pattern;

a first lens unit attached to the base spacer, wherein the first lens unit has a first substrate and a plurality of first lenses arranged in the lens pattern;

an intermediate spacer attached to the first lens unit, wherein the intermediate spacer has a plurality of openings arranged in the lens pattern; and

a second lens unit attached to the intermediate spacer, wherein the second lens unit has a second substrate and a plurality of second lenses arranged in the lens pattern, and wherein individual second lenses are aligned with corresponding first lenses.

11. The wafer level stacked lens assembly of claim 10 wherein the base spacer, the first substrate, the intermediate spacer, and the second substrate have approximately the same coefficient of thermal expansion.

12. The wafer level stacked lens assembly of claim 10 wherein the base spacer, the first substrate, the intermediate spacer, and the second substrate comprise glass wafers having a common diameter.

13. The wafer level stacked lens assembly of claim 12 wherein the first lenses comprise first polymer focal features on the first substrate and the second lenses comprise second polymer focal features on the second substrate.

14. The wafer level stacked lens assembly of claim 10, further comprising a top spacer attached to the second lens unit, wherein the top spacer has holes arranged in the lens pattern.

15. A method of manufacturing stacked lens assemblies for integrated imagers, comprising:

attaching a first lens unit having a plurality of first lenses arranged in a lens pattern to a base spacer having a plurality of apertures arranged in the lens pattern such that individual first lenses are aligned with corresponding apertures;

fixing an intermediate spacer having a plurality of openings arranged in the lens pattern to the first lens unit such that individual openings are aligned with corresponding first lenses; and

mounting a second lens unit having a plurality of second lenses arranged in the lens pattern to the intermediate spacer such that individual second lenses are aligned with corresponding openings of the intermediate spacer.

16. The method of claim 15, further comprising:

fabricating the first lens unit by forming first lens elements on one side of a first substrate and forming second lens elements on an opposing side of the first substrate, wherein the first lens elements are aligned with corresponding second lens elements, and wherein the first and second lens elements are formed using an imprint lithography process; and

fabricating the second lens unit by forming first lens elements on one side of a second substrate and forming second lens elements on an opposing side of the second substrate, wherein the first and second lens elements are formed using an imprint lithography process.

17. The method of claim 15, further comprising:

fabricating a portion of the first lens unit by forming first lens elements at one side of a first substrate;

bonding the base spacer to the first lens unit at the one side of the first substrate;

further fabricating the first lens unit after bonding the base spacer to the one side of the first substrate by forming second lens elements at an opposing side of the first substrate;

fabricating a portion of the second lens unit by forming second lens elements at one side of a second substrate;

bonding the intermediate spacer to the one side of the second substrate;

further fabricating the second lens unit after bonding the intermediate substrate to the one side of the second substrate by forming second lens elements at an opposing side of the first substrate; and

bonding the intermediate spacer to the first substrate after forming the second lens elements at the opposing side of the second substrate.

18. The method of claim 17 wherein the base spacer, the first substrate, the intermediate spacer, and the second substrate have a common coefficient of thermal expansion.

19. A method of manufacturing packaged imager assemblies, comprising:

forming a plurality of imager dies on an imager substrate having a first side and a second side, wherein individual imager dies have an image sensor and through substrate interconnects electrically coupled to the imager sensor, and wherein the image sensors are at the first side of the imager substrate and the through substrate interconnects have terminals at the second side of the substrate;

attaching individual stacked lens assemblies to the imager substrate at corresponding imager dies such that the stacked lens assemblies are spaced apart from each other by gaps, wherein individual stacked lens assemblies have a first lens unit and a second lens unit spaced apart from the first lens unit;

disposing an encapsulant in the gaps between the stacked lens assemblies; and

cutting through the imager substrate and the encapsulant between the dies such that encapsulant covers sides walls of the stacked lens assemblies.

20. The method of claim 19 wherein before attaching the individual stacked lens assemblies to the imager substrate, the method comprises providing the individual stacked lens assemblies by:

attaching the first lens unit to a base spacer, wherein the base substrate has a plurality of apertures arranged in a lens pattern and the first lens unit includes a first substrate and a plurality of first lenses arranged in the lens pattern and aligned with corresponding apertures;

fixing an intermediate spacer to the first lens unit, wherein the intermediate spacer includes a plurality of openings arranged in the lens pattern and aligned with corresponding first lenses; and

mounting the second lens unit to the intermediate spacer, wherein the second lens unit includes a second substrate and a plurality of second lenses arranged in the lens pattern and aligned with corresponding openings of the intermediate spacer.

21. The method of claim 20, further comprising:

fabricating the first lens unit by forming first lens elements on one side of the first substrate and forming second lens elements on an opposing side of the first substrate, wherein the first lens elements are aligned with corresponding second lens elements, and wherein the first and second lens elements are formed using an imprint lithography process; and

fabricating the second lens unit by forming first lens elements on one side of the second substrate and forming second lens elements on an opposing side of the second substrate, wherein the first and second lens elements are formed using an imprint lithography process.

22. The method of claim 20, further comprising:

fabricating a portion of the first lens unit by forming first lens elements at one side of the first substrate;

bonding the base spacer to the first lens unit at the one side of the first stratum;

further fabricating the first lens unit after bonding the base spacer to the one side of the first substrate by forming second lens elements at an opposing side of the first substrate;

fabricating a portion of the second lens unit by forming second lens elements at one side of the second substrate;

bonding the intermediate spacer to the one side of the second substrate;

further fabricating the second lens unit after bonding the intermediate substrate to the one side of the second substrate by forming second lens elements at an opposing side of the first substrate; and

bonding the intermediate spacer to the first substrate after forming the second lens elements at the opposing side of the second substrate.

23. The method of claim 20 wherein the base spacer, the first substrate, the intermediate spacer, and the second substrate have a common coefficient of thermal expansion.

24. The method of claim 23 wherein the base spacer, the first substrate, the intermediate spacer, and the second substrate are glass.

25. The method of claim 22 wherein forming the first and second lens elements of the first and second lens units comprises forming polymeric focal elements using imprint lithography processes.