METHOD FOR STACKING DEVICES
First Claim
Patent Images
1. A method for fabricating a semiconductor device, the method comprising:
- providing a first device, a second device, and a third device;
providing a first coating material between the first device and the second device;
providing a second coating material between the second device and the third device; and
thereafter, curing the first and second coating materials in a same process.
1 Assignment
0 Petitions
Accused Products
Abstract
A method for fabricating a semiconductor device is provided which includes providing a first device, a second device, and a third device, providing a first coating material between the first device and the second device, the first coating material being uncured, providing a second coating material between the second device and the third device, the second coating material being uncured, and thereafter, curing the first and second coating materials in a same process.
-
Citations
22 Claims
-
1. A method for fabricating a semiconductor device, the method comprising:
-
providing a first device, a second device, and a third device; providing a first coating material between the first device and the second device; providing a second coating material between the second device and the third device; and thereafter, curing the first and second coating materials in a same process. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
-
10. A semiconductor device, comprising:
-
a first device; a second device overlying the first device and electrically coupled to the first device; a third device overlying the second device and electrically coupled to the second device; a first coating material disposed between the first and second devices; and a second coating material disposed between the second and third devices; wherein the first and second coating materials are configured with substantially similar thermal histories. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17)
-
-
18. A method for fabricating a stacked semiconductor device, the method comprising:
-
providing a first device having a circuit and a first coating material formed thereon; stacking a second device on the first coating material and the first device, the second device having a circuit and a second coating material formed thereon; stacking a third device on second coating material and the second device, the third device having a circuit; and thereafter, performing one thermal process that electrically couples the circuits of the first, second, and third devices to form a circuit of the stacked semiconductor device, and that cures the first and second coating materials. - View Dependent Claims (19, 20, 21, 22)
-
Specification