Organic light emitting diode display and method of manufacturing the same

• US 20090322214A1
• Filed: 02/27/2009
• Published: 12/31/2009
• Est. Priority Date: 06/26/2008
• Status: Active Grant

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Inventors: Jung, Kyu-Ho, Jung, Woo-Suk, Kwak, Noh-Min, Lee, Duk-Jin, Park, Sang-Hun
• Granted Patent: US 8,492,969 B2
• Time in Patent Office: Days
• US Class Current: 313/504
• CPC Class Codes: H05B 33/04 Sealing arrangements , e.g. against humidity
• CPC Class Codes: H10K 50/841 Self-supporting sealing arrangements
• CPC Class Codes: H10K 59/871 Self-supporting sealing arrangements
• CPC Class Codes: Y02E 10/549 Organic PV cells
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

An organic light emitting diode (OLED) display and a method of manufacturing the same are provided. The OLED display includes: a display panel assembly including a first substrate having a display area and a mounting area, a second substrate coupled to the display area of the first substrate, and an integrated circuit chip mounted in the mounting area of the first substrate; a cover window disposed opposite the second substrate and the integrated circuit chip and covering the display panel assembly; and an adhesive layer which fills up a space between the second substrate and the cover window, and a space between the mounting area of the first substrate and the cover window.

Claims

1. An organic light emitting diode (OLED) display, comprising:

a display panel assembly comprising a first substrate having a display area and a mounting area, a second substrate coupled to the display area of the first substrate, and an integrated circuit chip mounted in the mounting area of the first substrate;

a cover window disposed opposite the second substrate and the integrated circuit chip, and covering the display panel assembly; and

an adhesive layer which fills a space between the second substrate and the cover window, and a space between the mounting area of the first substrate and the cover window.

2. The OLED display of claim 1, wherein the adhesive layer comprises an acryl-based resin and covers the integrated circuit chip.

3. The OLED display of claim 1, wherein the cover window is transparent.

4. The OLED display of claim 1, wherein the cover window comprises a light transmitting portion corresponding to a central portion of the display area and a light blocking portion corresponding to an edge of the display area and the mounting area.

5. The OLED display of claim 1, further comprising a support member which receives and supports the display panel assembly;

and

wherein the support member comprises a bottom portion formed in parallel with the first substrate, and a side wall which extends from the bottom portion and which surrounds side surfaces of the first substrate and the second substrate.

6. The OLED display of claim 5, wherein the side wall is formed apart by a predetermined distance from edges of the first substrate and the second substrate;

and

wherein the adhesive layer is formed by filling up a space between the side wall and edges of the first substrate and the second substrate.

7. The OLED display of claim 6, wherein the predetermined distance is greater than 200 μ

m.

8. A method of manufacturing an organic light emitting diode (OLED) display, comprising the steps of:

providing a display panel assembly which includes a first substrate having a display area and a mounting area, a second substrate coupled to the display area of the first substrate, and an integrated circuit chip mounted in the mounting area of the first substrate;

providing a cover window;

providing an adhesive material on one surface of the cover window;

coupling the cover window to the display panel assembly so that said one surface of the cover window on which the adhesive material is provided is opposite the second substrate and the integrated circuit chip;

diffusing the adhesive material so as to fill up a space between the second substrate and the cover window and a space between the mounting area of the first substrate and the cover window; and

forming an adhesive layer by curing the adhesive material.

9. The method of claim 8, wherein the adhesive material includes an acryl-based resin, and the adhesion layer is formed by curing the adhesive material through one of radiating ultraviolet (UV) rays and applying heat to the adhesive material.

10. The method of claim 8, further comprising the steps of allowing a part of the adhesive material provided on the cover window to flow and to contact a part of the display panel assembly, and then coupling the cover window and the display panel assembly.

11. The method of claim 8, further comprising the steps of:

receiving the display panel assembly in a support member;

providing the support member with a bottom portion formed in parallel with the first substrate, and a side wall which extends from the bottom portion and which surrounds side surfaces of the first substrate and the second substrate; and

disposing the side wall apart by a predetermined distance from edges of the first substrate and the second substrate.

12. The method of claim 11, wherein the step of forming the adhesive layer comprises filling and curing the adhesive material in a space between the side wall and the edges of the first substrate and the second substrate.

13. The method of claim 11, wherein the predetermined distance is greater than 200 μ

m.