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METHODS FOR AUTOMATICALLY CHARACTERIZING A PLASMA

  • US 20090322342A1
  • Filed: 06/02/2009
  • Published: 12/31/2009
  • Est. Priority Date: 06/26/2008
  • Status: Active Grant
First Claim
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1. A method for automatically characterizing plasma during substrate processing, comprising:

  • collecting a set of process data, said set of process data including at least data about current and voltage;

    identifying a relevancy range for said set of process data, wherein said relevancy range including a subset of said set of process data;

    determining a set of seed values; and

    employing said relevancy range and said set of seed values to perform curve-fitting, wherein said curve-fitting enables said plasma to be automatically characterized.

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