METHODS FOR AUTOMATICALLY CHARACTERIZING A PLASMA
First Claim
1. A method for automatically characterizing plasma during substrate processing, comprising:
- collecting a set of process data, said set of process data including at least data about current and voltage;
identifying a relevancy range for said set of process data, wherein said relevancy range including a subset of said set of process data;
determining a set of seed values; and
employing said relevancy range and said set of seed values to perform curve-fitting, wherein said curve-fitting enables said plasma to be automatically characterized.
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Abstract
A method for automatically characterizing plasma during substrate processing is provided. The method includes collecting a set of process data, which includes at least data about current and voltage. The method also includes identifying a relevancy range for the set of process data, wherein the relevancy range includes a subset of the set of process data. The method further includes determining a set of seed values. The method yet also includes employing the relevancy range and the set of seed values to perform curve-fitting, wherein the curve-fitting enables the plasma to be automatically characterized.
53 Citations
20 Claims
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1. A method for automatically characterizing plasma during substrate processing, comprising:
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collecting a set of process data, said set of process data including at least data about current and voltage; identifying a relevancy range for said set of process data, wherein said relevancy range including a subset of said set of process data; determining a set of seed values; and employing said relevancy range and said set of seed values to perform curve-fitting, wherein said curve-fitting enables said plasma to be automatically characterized. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An article of manufacture comprising a program storage medium having computer readable code embodied therein, said computer readable code being configured for automatically characterizing plasma during substrate processing, comprising:
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code for collecting a set of process data, said set of process data including at least data about current and voltage; code for identifying a relevancy range for said set of process data, wherein said relevancy range including a subset of said set of process data; code for determining a set of seed values; and code for employing said relevancy range and said set of seed values to perform curve-fitting, wherein said curve-fitting enables said plasma to be automatically characterized. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification