METHOD FOR ASSEMBLING A DIGITIZER SENSOR

• US 20090322696A1
• Filed: 06/18/2009
• Published: 12/31/2009
• Est. Priority Date: 06/18/2008
• Status: Abandoned Application

• Current Assignee: N-Trig Ltd (Microsoft Corporation)
• Original Assignee: N-Trig Ltd (Microsoft Corporation)
• Inventors: Teomim, Doron, Kaimonovich, Alex, YAAKOBY, Merav, Brecher, Dov, Nachshon, Dov
• Application Number:
  US12/486,787
• Publication Number:
  US 20090322696A1
• Time in Patent Office: Days
• US Class Current: 345/173
• CPC Class Codes: G06F 3/041 Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• CPC Class Codes: G06F 3/04164 Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor

Abstract

A digitizer assembly includes a transparent sensor patterned with conductive elements within at least one layer, a PCB or the like patterned with conductive elements positioned along at least one edge of the transparent sensor, wherein the conductive elements at least partially match the conductive elements on the transparent sensor, and a double sided adhesive positioned between the transparent sensor and the PCB operative to mount the PCB on to the transparent sensor.

Claims

1. A digitizer assembly including:

a transparent sensor patterned with conductive elements within at least one layer;

a PCB or the like patterned with conductive elements positioned along at least one edge of the transparent sensor, wherein the conductive elements at least partially match the conductive elements on the transparent sensor; and

a double sided adhesive positioned between the transparent sensor and the PCB operative to mount the PCB on to the transparent sensor.

2. The assembly according to claim 1, wherein the double sided adhesive is formed from alternate strips of conductive and non-conductive double sided adhesive.

3. The assembly according to claim 2, wherein the conductive double sided adhesive is operative to provide electrical contact between conductive elements on the transparent sensor and conductive elements on the PCB.

4. The assembly according to claim 1, wherein the double sided adhesive includes a pattern of openings that at least partially correspond to the conductive elements on the transparent sensor and the PCB.

5. The assembly according to claim 4 wherein the openings are filled with conductive material.

6. The assembly according to claim 5, wherein the conductive material is conductive adhesive.

7. The assembly according to claim 5, wherein the conductive material is operative to provide electrical contact between conductive elements on the transparent sensor and conductive elements on the PCB.

8. The assembly according to claim 5, wherein the double sided adhesive is operative to prevent lateral flow of the conductive material out of the openings.

9. The assembly according to claim 4, wherein the double sided adhesive is non-conductive.

10. The assembly according to claim 4, wherein the openings are holes or gaps in the double sided adhesive.

11. The assembly according to claim 4, wherein the shapes or sizes of the opening correspond to the shape or size of the conductive elements.

12. The assembly according to claim 1 wherein the pattern of conductive elements on the transparent sensor and on the PCB or the like include an array of conductive elements.

13. The assembly according to claim 1, wherein the transparent sensor includes at least one array of conductive lines and the pattern of conductive elements is formed on at least one of the ends of the conductive lines.

14. The assembly according to claim 1, wherein the pattern conductive elements includes at least one array of conductive lines.

15. The assembly according to claim 13, wherein the conductive lines are constructed from a transparent material.

16. The assembly according to claim 1, wherein the transparent sensor is constructed from a temperature sensitive material.

17. The assembly according to claim 1, wherein the transparent sensor is constructed from a pressure sensitive material.

18. The assembly according to claim 1, wherein the transparent sensor is constructed from a glass substrate or a PET foil.

19. A method for mounting a PCB or like substrate onto a transparent sensor each having a pattern of conductive elements thereon wherein the two patterns at least partially correspond, the method comprising:

mounting a double-sided adhesive comprising a pattern of openings on one of the PCB or transparent sensor each comprising a pattern of conductive elements such that the openings on the double sided adhesive at least partially expose at least a portion of the pattern of conductive elements, and

mounting the other one of the PCB or transparent sensor on the double sided adhesive so that at least a portion of its pattern of conductive elements correspond to at least a portion of the pattern of openings on the double sided adhesive.

20. The method according to claim 19, comprising injecting a conductive material in at least one of the openings.

21. The method according to claim 20, wherein the double sided adhesive is operative to prevent lateral flow of the conductive material out of the openings.

22. The method according to claim 20, wherein the conductive material is a conductive adhesive.

23. The method according to claim 19, wherein the double sided adhesive is non-conductive.

24. The method according to claim 19, wherein the openings are holes or gaps in the double sided adhesive.

25. The method according to claim 19, wherein the shapes or sizes of the opening correspond to the shape or size of the conductive elements.

26. The method according to claim 19, wherein the transparent sensor includes at least one array of conductive lines and the pattern of conductive elements is formed on at least one end of the conductive lines.

27. The method according to claim 19, wherein the pattern of conductive elements includes at least one array of conductive lines.

28. A method for mounting a PCB or like substrate onto a transparent sensor each having a pattern of conductive elements thereon wherein the two patterns at least partially correspond, the method comprising:

mounting a double-sided adhesive comprising a pattern of conductive and non-conductive portions on one of the PCB or transparent sensor each comprising a pattern of conductive elements such that the conductive portions on the double sided adhesive at least partially correspond to at least a portion of the pattern of conductive elements, and

mounting the other one of the PCB or transparent sensor on double sided adhesive so that at least a portion of its pattern of conductive elements correspond to at least a portion of the conductive portions of the double sided adhesive.

29. The method according to claim 28, wherein the double sided adhesive is formed from alternate strips of conductive and non-conductive double sided adhesive.

30. The method according to claim 28, wherein the non-conductive portions form a pattern of openings and the conductive portions cover the openings formed by the non-conductive portions.

31. The method according to claim 30, wherein the openings are holes or gaps in the double sided adhesive.

32. The method according to claim 30, wherein the shapes or sizes of the opening correspond to the shape or size of the conductive elements.

33. The method according to claim 28, wherein the conductive portions on the double sided adhesive is operative to provide electrical contact between conductive elements on the transparent sensor and conductive elements on the PCB.

34. A double sided adhesive for mounting a PCB or the like onto a transparent sensor, the double sided adhesive comprising:

a pattern of conductive and non-conductive portions of double sided adhesive,

wherein at least a part of the conductive portions correspond to pattern of conductive elements on the transparent sensor and a matching pattern of conductive elements on the PCB.

35. The double sided adhesive according to claim 34, wherein the non-conductive portions form openings and the conductive portions fill or cover the openings.

36. The double sided adhesive according to claim 35, wherein the openings are holes, wells or gaps.

37. The double sided adhesive according to claim 34, wherein the double sided adhesive is formed from alternate strips of conductive and non-conductive double sided adhesive.

38. The double sided adhesive according to claim 34, wherein the conductive portions of the double sided adhesive are operative to provide electrical contact between conductive elements on the transparent sensor and conductive elements on the PCB.