HIGH PERFORMANCE SPREADER FOR LID COOLING APPLICATIONS
First Claim
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1. A system comprising:
- a processing unit;
a display communicatively coupled to the processing unit; and
a heat spreader plate thermally coupled to the display and/or the processing unit, the heat spreader plate having one or more pulsating heat pipes with each of the one or more pulsating heat pipes configured to contain a fluid within a sealed boundary, the heat spreader plate having a first section to operate as an evaporator in a presence of heat sourced from the display and/or the processing unit to induce a liquid-to-vapor phase change of fluid within a portion of the one or more pulsating heat pipes in the evaporator, and a second section to operate as a condenser to induce a vapor-to-liquid phase change of fluid within a portion of the one or more pulsating heat pipes in the condenser such that the fluid pulsates between the evaporator and the condenser to transfer heat sourced from the display and/or the processing unit to the condenser.
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Abstract
Apparatuses, systems, and methods for a heat spreader plate and pulsating heat pipes to transfer heat sourced from one or more electronic components are described herein. Other embodiments may also be described and claimed.
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Citations
20 Claims
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1. A system comprising:
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a processing unit; a display communicatively coupled to the processing unit; and a heat spreader plate thermally coupled to the display and/or the processing unit, the heat spreader plate having one or more pulsating heat pipes with each of the one or more pulsating heat pipes configured to contain a fluid within a sealed boundary, the heat spreader plate having a first section to operate as an evaporator in a presence of heat sourced from the display and/or the processing unit to induce a liquid-to-vapor phase change of fluid within a portion of the one or more pulsating heat pipes in the evaporator, and a second section to operate as a condenser to induce a vapor-to-liquid phase change of fluid within a portion of the one or more pulsating heat pipes in the condenser such that the fluid pulsates between the evaporator and the condenser to transfer heat sourced from the display and/or the processing unit to the condenser. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An apparatus comprising:
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one or more pulsating heat pipes, each of the one or more pulsating heat pipes configured to contain a fluid within a sealed boundary; and a heat spreader plate having the one or more pulsating heat pipes integrated therein, the heat spreader plate configured to be disposed within a housing of a computing device and having a first section and a second section configured to operate as evaporators, when thermally coupled to respective first and second operating electronic components, to induce a liquid-to-vapor phase change of fluid within a portion of the one or more pulsating heat pipes in the evaporators, and a third section configured to operate as a condenser to induce a vapor-to-liquid phase change of fluid within one or more portions of the one or more pulsating heat pipes in the condenser such that the fluid pulsates between the evaporators and the condenser to transfer heat sourced from the first and second operating electronic components to the condenser. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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18. A method comprising:
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forming one or more pulsating heat pipe channels integrally into a chassis of a mobile computing device; bonding a cover plate to the chassis to form one or more pulsating heat pipes respectively corresponding to the one or more pulsating heat pipe channels; evacuating the one or more pulsating heat pipes; and partially filling the one or more pulsating heat pipes with a fluid. - View Dependent Claims (19, 20)
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Specification