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TIN PHOSPHATE BARRIER FILM, METHOD, AND APPARATUS

  • US 20090324830A1
  • Filed: 09/03/2009
  • Published: 12/31/2009
  • Est. Priority Date: 08/24/2006
  • Status: Active Grant
First Claim
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1. A method of inhibiting oxygen and moisture penetration of a device, comprising the steps of:

  • heating a tin phosphate starting material substantially free of fluorine in an electrically resistive heating element comprising tungsten, the heating comprising delivering a first electrical power to the resistive heating element to react the tungsten of the heating element with the tin phosphate starting material, then delivering a second electrical power to the resistive heating element greater than the first electrical power to volatilize the reacted tin phosphate starting material;

    depositing a tin phosphate low liquidus temperature inorganic material, resulting from volatilizing the reacted tin phosphate starting material, in a layer on at least a portion of the deviceheat treating the layer in a substantially oxygen and moisture free environment to form a hermetic seal; and

    wherein the deposited layer comprises from greater than 0 to about 10 wt. % tungsten.

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