PROTECTIVE COAT AND METHOD FOR MANUFACTURING THEREOF

• US 20090324844A1
• Filed: 06/03/2009
• Published: 12/31/2009
• Est. Priority Date: 03/31/2003
• Status: Abandoned Application

• Current Assignee: Daisaku Haoto, Kenji Tanaka
• Original Assignee: Daisaku Haoto, Kenji Tanaka
• Inventors: TANAKA, Kenji, HAOTO, Daisaku
• Application Number:
  US12/477,322
• Publication Number:
  US 20090324844A1
• Time in Patent Office: Days
• US Class Current: 427/527
• CPC Class Codes: C23C 14/0676 Oxynitrides
• CPC Class Codes: Y10T 428/265 1 mil or less

Abstract

A method for producing a protective coat formed on the top surface of a substrate, or on the top surface of a thin film layered body formed on the substrate is disclosed, wherein the protective coat comprises silicon oxynitride in which the atomic ratio of Si/O/N is 100/X/Y (130≦X+Y≦180, 10≦X≦135, 5≦Y≦150), wherein the protective coat is formed by a sputtering method in which silicon nitride is used as a target material, an inert gas is used as a sputtering gas, and N₂ is used as a reactive feed gas. The oxygen component of the obtained protective coat comprising the silicon oxynitride is incorporated into the composition of the protective coat by degradation of moisture that was present in the substrate or the thin film layered body or in the reaction apparatus.

Claims

1. A method for producing a protective coat formed on the top surface of a substrate, or on the top surface of a thin film layered body formed on the substrate and comprising silicon oxynitride in which the atomic ratio of Si/O/N is 100/X/Y (130≦

X+Y≦

180, 10≦

X≦

135, 5≦

Y≦

150), wherein the protective coat is formed by a sputtering method in which silicon nitride is used as a target material, an inert gas is used as a sputtering gas, and N₂ is used as a reactive feed gas.

3. The method for producing a protective coat according to claim 1, characterized in that the oxygen component of the obtained protective coat comprising the silicon oxynitride is incorporated into the composition of the protective coat by degradation of moisture that was present in the substrate or the thin film layered body or in the reaction apparatus.

4. The method for producing a protective coat according to claim 1, wherein the protective coat comprising the silicon oxynitride is produced using an in-line sputtering apparatus, employing conditions of an applied output of 2.50 to 7.00 W/cm² and a distance between the target and the substrate of 12 cm or less.

5. The method for producing a protective coat according to claim 3, wherein the protective coat comprising the silicon oxynitride is produced using an in-line sputtering apparatus, employing conditions of an applied output of 2.50 to 7.00 W/cm² and a distance between the target and the substrate of 12 cm or less.

2. A method for producing a protective coat formed on the top surface of a substrate, or on the top surface of a thin film layered body formed on the substrate and comprising silicon oxynitride in which the atomic ratio of Si/O/N is 100/X/Y (130≦

X+Y≦

180, 10≦

X≦

135, 5≦

Y≦

150), wherein the protective coat is formed by an ion plating method in which silicon nitride is used as a material and N₂ is used as a reactive feed gas.

6. The method for producing a protective coat according to claim 2, characterized in that the oxygen component of the obtained protective coat comprising the silicon oxynitride is incorporated into the composition of the protective coat by degradation of moisture that was present in the substrate or the thin film layered body or in the reaction apparatus.

7. A method for producing a protective coat, characterized in that the protective coat comprising two or more layers of different compositions is formed in a vacuum process using the same raw materials for film formation by controlling a conveying speed, wherein the first layer is produced while being allowed to react with a component of gas emitted from the substrate or the thin film layered body formed on the substrate, and subsequently, at the time of formation of the second layer, the obtained first layer acts as a cap layer to block the gas emitted from the substrate or the thin film layered body formed on the substrate, wherein the protective coat is formed on the top surface of a substrate, or on the top surface of a thin film layered body formed on the substrate, and wherein the protective coat comprises two or more layers having at least a comparatively thin first layer formed on the top surface of a substrate, or on the top surface of a thin film layered body formed on the substrate, and a comparatively thick second layer formed on the top surface of the first layer and having a different composition from the first layer, wherein the first layer is a silicon oxide film and the second layer is a silicon nitride oxide film or a silicon nitride film, and wherein the first layer has a thickness of 200 Å

-1500 Å

, and the second layer has a thickness of 1500 Å

-3000 Å

), and wherein the substrate or the top surface of the thin film layered body on which the protective coat is coated is selected from the group consisting of acrylic UV curable resins, polyethylene naphthalate and polyethersulfone.

8. A method for producing a protective coat, characterized in that the first layer is an oxide film and the second layer is a nitride oxide film or a nitride film, wherein the oxygen component of the obtained protective coat is incorporated into the composition of the protective coat by degradation of moisture that was present in the substrate or the thin film layered body or in the reaction apparatus, wherein the protective coat is formed on a substrate having a color filter layer formed thereon.