Printed substrate and electronic device

• US 20090324885A1
• Filed: 02/24/2009
• Published: 12/31/2009
• Est. Priority Date: 06/27/2008
• Status: Abandoned Application

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Mizuno, Yusuke
• Application Number:
  US12/379,548
• Publication Number:
  US 20090324885A1
• Time in Patent Office: Days
• US Class Current: 428/137
• CPC Class Codes: H05K 1/0271 Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: Y10T 428/24322 Composite web or sheet

Abstract

A printed substrate includes: a plurality of pads provided in a mounting area, and having a polygonal shape, in which an electronic component is mounted; and a hole facing and extending along at least two adjacent sides of the polygonal shape.

Claims

1. A printed substrate comprising:

a plurality of pads provided in a mounting area, and having a polygonal shape, in which an electronic component is mounted; and

a hole facing and extending along at least two adjacent sides of the polygonal shape.

2. The printed substrate of claim 1 wherein the hole at least comprises:

a first hole extending along a first side and a second side of the polygonal shape; and

a second hole extending along a third side and a forth side of the polygonal shape and being apart from the first hole.

3. The printed substrate of claim 2 wherein the first side and the third side oppose to each other in the polygonal shape, and the second side of the forth side oppose to each other in the polygonal shape.

4. The printed substrate of claim 2 wherein the hole comprises:

a third hole extending along the first side and the forth side of the polygonal shape and being apart from the first hole and the second hole; and

a forth hole extending along the second side and the third side of the polygonal shape and being apart from the second hole and the forth hole.

5. The printed substrate of claim 1 wherein:

the electronic component comprising a plurality of solder bumps connecting with the plurality of the pads and being mounted in the printed substrate; and

the hole faces an edge of the electronic component.

6. The printed substrate of claim 5 wherein at least one of the solder bumps is made of a lead-free solder.

7. An electronic device comprising:

a printed substrate comprising;

a plurality of pads provided within a mounting area, having a polygonal shape, in which an electronic component is mounted; and

a hole facing and extending along at least two adjacent sides of the polygonal shape; and

a housing housing the printed substrate.

8. A printed substrate comprising:

a plurality of pads provided in a mounting area, having a polygonal shape, in which an electronic component is mounted; and

a hole facing a corner portion of the mounting area.

9. The printed substrate of claim 8 wherein:

the electronic component comprising a plurality of solder bumps connecting with the plurality of the pads and being mounted in the printed substrate; and

the hole facing a corner portion of the electronic component.

10. An electronic device comprising:

a printed substrate comprising;

a plurality of pads provided within a mounting area, having a polygonal shape, in which an electronic component is mounted; and

a hole facing a corner portion of the mounting area; and

a housing housing the printed substrate.