Connecting Scheme for Orthogonal Assembly of Microstructures

• US 20090325424A1
• Filed: 04/28/2008
• Published: 12/31/2009
• Est. Priority Date: 04/27/2007
• Status: Abandoned Application

• Current Assignee: Albert-Ludwigs-Universitat Freiburg Fahnenbergplatz, Interuniversitair Micro-Electronica Centrum VZW (IMEC International), Katholieke Universiteit Leuven
• Original Assignee: Albert-Ludwigs-Universitat Freiburg Fahnenbergplatz, Interuniversitair Micro-Electronica Centrum VZW (IMEC International), Katholieke Universiteit Leuven
• Inventors: Ruther, Patrick, Puers, Robert, Beyne, Eric, Van Hoof, Chris, Aarts, Arno, Pereira Neves, Hercules
• Application Number:
  US12/110,676
• Publication Number:
  US 20090325424A1
• Time in Patent Office: Days
• US Class Current: 439/676
• CPC Class Codes: A61B 2562/125 characterised by the manufacture of electrodes
• CPC Class Codes: A61B 5/24 Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
• CPC Class Codes: A61B 5/291 for electroencephalography [EEG]
• CPC Class Codes: A61N 1/0529 Electrodes for brain stimulation
• CPC Class Codes: A61N 1/0531 Brain cortex electrodes
• CPC Class Codes: B81B 2201/055 Microneedles
• CPC Class Codes: B81C 3/008 Aspects related to assembling from individually processed components, not covered by groups B81C3/001 - B81C3/002
• CPC Class Codes: Y10T 29/49222 forming array of contacts or terminals

Abstract

In the present disclosure a device for sensing and/or actuation purposes is presented in which microstructures (20) comprising shafts (2) with different functionality and dimensions can be inserted in a modular way. That way, out-of-plane connectivity, mechanical clamping between the microstructures (20) and a substrate (1) of the device, and electrical connection between electrodes (5) on the microstructures (20) and the substrate (1) can be realized. Connections to external circuitry can be realised. Microfluidic channels (10) in the microstructures (20) can be connected to external equipment. A method to fabricate and assemble the device is provided.

Claims

1. A device comprising:

a substrate with at least one cavity, wherein the substrate and the cavity have at least an insulating surface;

at least one microstructure comprising a connector part and at least one shaft, the connector part being inserted in said cavity, the microstructure comprising at least one conductive area extending at least partially on the connector part and at least partially on the shaft;

at least one flexible conductive blade at the cavity, a first part of the conductive blade being outside the cavity and a second part being inside the cavity between the connector part and a sidewall of the cavity, such that the conductive blade is in electrical contact with the conductive area of the microstructure.

2. A device according to claim 1, wherein the dimensions of the cavity substantially match the dimensions of the connector part of the microstructure.

3. A device according to claim 1, wherein the cavity and the connector part have dimensions between 50 μ

m and 2000 μ

m.

4. A device according to claim 1, wherein an angle between the substrate and the microstructure is between 45°

and 90°

.

5. A device according to claim 1, wherein the width of the conductive blade and the length of the second part of the conductive blade is between 1 μ

m and 100 μ

m.

6. A device according to claim 1, further comprising conductive paths on the substrate for connecting the conductive blade with bond pads or integrated circuitry in the substrate.

7. A device according to claim 1, further comprising functional areas on the microstructure in contact with the conductive area.

8. A device according to claim 1, further comprising a first microfluidic channel in the substrate and a second microfluidic channel in the microstructure, the first and second microfluidic channels being connected to each other with at least one sealed hole in the cavity.

9. A device according to claim 1, wherein the microstructure is a needle.

10. A device according to claim 1, wherein the substrate has a thickness between 200 μ

m and 2000 μ

m.

11. A device according to claim 1, wherein the substrate is a semiconductor wafer or a thinned semiconductor wafer covered with insulating material.

12. A device according to claim 1 wherein the conductive area and the blade comprise at least one conductive material.

13. A device according to claim 1, wherein the blade comprises a flexible material.

14. A device according to claim 1, wherein the substrate, the microstructure, the conductive blade, and the conductive area are made of or covered with biocompatible materials.

15. Use of a device according to claim 1 for measurements or actuation.

16. Use of a device according to claim 1 for measurements or actuation of neural activity.

39. A device according to claim 1, further comprising clamping structures in at least part of the cavities of the substrate for clamping the connector parts of the microstructures in the cavities.

40. A device according to claim 39, wherein each of the clamping structures comprises at least one flexible beam attached to a sidewall of the cavity in which it is located, and wherein there is a gap in between the bottom of the cavity and the clamping structure.

17. A method comprising:

obtaining a substrate with at least one cavity, the substrate and the cavity having an insulating surface, the substrate further having at least one flexible conductive blade near each cavity, said conductive blade partially overhanging the cavity;

obtaining at least one microstructure comprising a connector part, at least one shaft, and at least one conductive area extending at least partially on the connector part and at least partially on the shaft, the connector part being shaped such as to fit into the cavity, the conductive area being located so as to contact the conductive blade upon insertion of the connector part into the cavity;

inserting the connector part of the microstructure into the cavity, thereby bending the conductive blade in the cavity and realizing electrical contact between the conductive blade and the conductive area; and

fixing the connector part inside the cavity.

18. A method according to claim 17, further comprising fabricating at least one functional area on the microstructure in contact with the conductive area.

19. A method according to claim 17, further comprising providing at least one bond pad on the substrate or integrated circuitry in the substrate and providing at least one conductive path on the substrate connecting the flexible conductive blade with the bond pad or integrated circuitry.

20. A method according to claim 17, further comprising:

providing a first microfluidic channel in the substrate;

providing a second microfluidic channel in the microstructure, whereby the first microfluidic channel is connected to the second microfluidic channel via a hole in the cavity; and

sealing the hole in the cavity.

21. A method according to claim 20, further comprising connecting the flexible conductive blade or the microfluidic channels to measurement equipment.

22. A method according to claim 17 wherein providing the flexible conductive blade comprises:

filling the cavity with a sacrificial material;

providing at least one conductive blade partially on the sacrificial material; and

removing the sacrificial material from the cavity.

23. A method according to claim 22 wherein the sacrificial material is polyimide or Benzocyclobutene (BCB).

24. A method according to claim 17, wherein providing the flexible conductive blade and the conductive path is done by metal deposition and lift-off, or by metal deposition and patterning by dry or wet etching.

25. A method according to claim 17, wherein realizing electrical contact between the conductive blade and the conductive area is done by caulking.

26. A method according to claim 17, wherein the dimensions of the connector part are slightly different from the dimensions of the cavity, and fixing the connector part in the cavity comprises:

creating a temperature difference between the substrate and the connector part such as to allow insertion of the connector part into the cavity;

inserting the connector part into the cavity; and

bringing the substrate and the connector part to the same temperature.

41. A method according to claim 17, further comprising fabricating clamping structures in at least part of the cavities of the substrate for clamping the connector parts of the microstructures in the cavities.

42. A method according to claim 41, wherein each of the clamping structures comprises at least one flexible beam attached to a sidewall of the cavity in which it is located, and wherein each of the clamping structures is positioned to leave a gap between the bottom of the cavity and the respective clamping structure.

27. A device comprising:

a substrate having a plurality of cavities;

a plurality of flexible conductive blades on the substrate, each of these conductive blades extending into a cavity; and

a plurality of microstructures, each microstructure comprising a connector part and a shaft;

wherein the connector part of each microstructure extends into one of the cavities and is resiliently engaged by at least one of the conductive blades, and the shaft of each microstructure extends above the surface of the substrate; and

wherein at least one of the microstructures is a probe that includes at least one electrode on the shaft and at least one connector pad on the connector part, the connector pad being electrically connected to the electrode and to at least one of the conductive blades.

28. A device according to claim 27, wherein a plurality of the shafts extend substantially orthogonally from the substrate.

29. A device according to claim 28, wherein the cavities are arranged in a substantially two-dimensional array.

30. A device according to claim 27, wherein at least one of the microstructures is a probe that includes a plurality of electrodes at different positions along the shaft, each electrode being electrically connected to a respective one of the connector pads, and each of the respective connector pads being connected to a respective one of the conductive blades.

31. A device according to claim 30, wherein the plurality of electrodes on the plurality of probes collectively form a three-dimensional array.

32. A device according to claim 27, further comprising:

at least one first microfluidic channel extending through the substrate and terminating at a cavity; and

a second microfluidic channel extending through at least one of the microstructures;

wherein the first and second microfluidic channels are in fluid communication with one another.

33. A device according to claim 32, further comprising fluid-control equipment in fluid communication with the microfluidic channels, the fluid-control equipment being operative to dispense a drug through the microfluidic channels.

34. A device according to claim 33, further comprising recording equipment in electrical communication with at least one of the probes.

35. A device according to claim 27, wherein at least one of the microstructures includes a temperature sensor.

36. A device according to claim 27, wherein at least one of the microstructures includes a biosensor for detecting biomolecules.

37. A device according to claim 27, further comprising, a plurality of bond pads on the substrate forming electrical connections with respective conductive blades.

38. A device according to claim 27, further comprising integrated circuitry on the substrate, wherein the integrated circuitry forms electrical connections with the conductive blades.

43. A device according to claim 27, further comprising clamping structures in at least part of the cavities of the substrate for clamping the connector parts of the microstructures in the cavities.

44. A device according to claim 43, wherein each of the clamping structures comprises at least one flexible beam attached to a sidewall of the cavity in which it is located, and wherein there is a gap in between the bottom of the cavity and the clamping structure.