SUBSTRATE SUPPORTING UNIT AND SINGLE TYPE SUBSTRATE POLISHING APPARATUS USING THE SAME

• US 20090325469A1
• Filed: 11/19/2008
• Published: 12/31/2009
• Est. Priority Date: 06/30/2008
• Status: Active Grant

• Current Assignee: Semes Co., Ltd (Samsung Electronics Co. Ltd.)
• Original Assignee: Semes Co., Ltd (Samsung Electronics Co. Ltd.)
• Inventors: Choi, Ki-Hoon, Son, Duk-Hyun, Yoon, Chang-Ro, Goo, Se-Hun, KOO, Gyo-Woog, Cho, Jung-Gun, Choi, Jung-Bong
• Granted Patent: US 8,113,918 B2
• Time in Patent Office: Days
• US Class Current: 451/54
• CPC Class Codes: B24B 37/30 for single side lapping of plane surfaces
• CPC Class Codes: H01L 21/6838 with gripping and holding devices using a vacuum; Bernoulli devices
• CPC Class Codes: H01L 21/68728 characterised by a plurality of separate clamping members, e.g. clamping fingers
• CPC Class Codes: H01L 21/68742 characterised by a lifting arrangement, e.g. lift pins

Abstract

Provided are a substrate supporting unit and a single type substrate polishing apparatus using the substrate supporting unit. During a polishing process, the bottom surface of a substrate is attached to the substrate supporting unit by vacuum suction, and during a post-cleaning process, the substrate is supported by the substrate supporting unit at a position spaced apart from the substrate supporting unit for cleaning the bottom surface of the substrate. Therefore, according to the substrate supporting unit and the substrate polishing apparatus using the substrate supporting unit, in a state where the substrate is supported by the single type substrate supporting unit, a process for polishing the top surface of the substrate and a post-process for cleaning the top and bottom surfaces of the substrate can be sequentially performed.

Claims

1. A substrate supporting unit comprising:

a vacuum plate to which a substrate is attached by vacuum suction;

a supporting plate disposed under the vacuum plate at a predetermined distance from the vacuum plate, and at which chucking members are disposed to clamp the substrate; and

a driving member configured to move the vacuum plate or the supporting plate upward and downward so as to allow the chucking members to support the substrate in a state where the substrate is spaced upwardly from the supporting plate.

2. The substrate supporting unit of claim 1, wherein the driving member comprises:

upper and lower magnet members vertically arranged under the supporting plate to face each other, the upper and lower magnet members being oriented with opposing poles thereof facing each other such that a magnetic repulsive force acts between the upper and lower magnet members;

connection members having ends connected to the vacuum plate and the other ends connected to the upper magnet member; and

a linear driving unit configured to move the lower magnet member upward and downward.

3. The substrate supporting unit of claim 2, wherein each of the upper and lower magnet members has a ring shape.

4. The substrate supporting unit of claim 2, wherein the connection members have a bar shape and are inserted in holes formed through the supporting plate.

5. The substrate supporting unit of claim 2, further comprising an elastic member configured to exert an elastic repulsive force between the supporting plate and the upper magnet member.

6. The substrate supporting unit of claim 2, further comprising a sensing member configured to detect whether the lower magnet member is vertically moved to a preset height.

7. The substrate supporting unit of claim 2, wherein the chucking members comprise:

supporting pins configured to support a bottom surface of the substrate; and

chucking pins configured to support an edge of the substrate,

wherein holes are formed through the vacuum plate for receiving the supporting pins and the chucking pins when the supporting plate is moved upward and downward.

8. The substrate supporting unit of claim 2, wherein a detachment preventing jaw protrudes from an edge portion of the vacuum plate to prevent detachment of the substrate attached to the vacuum plate by vacuum suction.

9. The substrate supporting unit of claim 2, wherein a buffer member formed of an elastic material is disposed on a top surface of the vacuum plate to prevent the substrate attached to the vacuum plate by vacuum suction from being deformed by a foreign substance existing between the substrate and the vacuum plate.

10. The substrate supporting unit of claim 1, wherein the driving member comprises:

an upper magnet member disposed at the supporting plate;

a lower magnet member disposed under the upper magnet member to face the upper magnet member, poles of the lower magnet member being oriented such that a magnetic repulsive force acts between the upper and lower magnet members; and

a linear driving unit configured to move the lower magnet member upward and downward.

11. The substrate supporting unit of claim 10, wherein the chucking members comprise:

supporting pins configured to support a bottom surface of the substrate; and

L-shaped chucking rods rotatably disposed outside the supporting pins for supporting an edge of the substrate,

wherein holes are formed through the vacuum plate for receiving the supporting pins when the supporting plate is moved upward and downward.

12. The substrate supporting unit of claim 11, wherein a pressing member protrudes from a bottom surface of the vacuum plate, and

when the supporting plate is moved upward, the pressing member presses horizontal parts of the L-shaped chucking rods to rotate the chucking rods such that vertical parts of the rotated chucking rods support the edge of the substrate.

13. The substrate supporting unit of claim 10, further comprising a guide member disposed at a rotation shaft connected to a bottom surface of the vacuum plate for guiding upward and downward movements of the supporting plate.

14. The substrate supporting unit of claim 10, further comprising an elastic member configured to exert an elastic repulsive force between the vacuum plate and the supporting plate.

15. A single type substrate polishing apparatus comprising:

a process chamber;

a substrate supporting unit disposed in the process chamber for supporting a substrate;

a polishing unit configured to polish the substrate; and

a cleaning unit configured to clean the polished substrate,

wherein the substrate supporting unit comprises;

a vacuum plate to which the substrate is attached by vacuum suction;

a supporting plate disposed under the vacuum plate at a predetermined distance from the vacuum plate, and at which chucking members are disposed to clamp the substrate; and

a driving member configured to move the vacuum plate or the supporting plate upward and downward so as to allow the chucking members to support the substrate in a state where the substrate is spaced upwardly from the supporting plate.

16. The single type substrate polishing apparatus of claim 15, wherein the driving member comprises:

upper and lower magnet members vertically arranged under the supporting plate to face each other, the upper and lower magnet members being oriented with opposing poles thereof facing each other such that a magnetic repulsive force acts between the upper and lower magnet members;

connection members having ends connected to the vacuum plate and the other ends connected to the upper magnet member; and

a linear driving unit configured to move the lower magnet member upward and downward.

17. The single type substrate polishing apparatus of claim 16, wherein the chucking members comprise:

supporting pins configured to support a bottom surface of the substrate; and

chucking pins configured to support an edge of the substrate,

wherein holes are formed through the vacuum plate for receiving the supporting pins and the chucking pins when the supporting plate is moved upward and downward.

18. The single type substrate polishing apparatus of claim 16, wherein the connection members have a bar shape and are inserted in holes formed through the supporting plate, and

coil shaped elastic members are disposed around the bar-shaped connection members between the supporting plate and the upper magnet member.

19. The single type substrate polishing apparatus of claim 16, further comprising a sensing member configured to detect whether the lower magnet member is vertically moved to a preset height.

20. The single type substrate polishing apparatus of claim 16, wherein a detachment preventing jaw protrudes from an edge portion of the vacuum plate to prevent detachment of the substrate attached to the vacuum plate by vacuum suction, and

a buffer member formed of an elastic material is disposed on a top surface of the vacuum plate to prevent the substrate attached to the vacuum plate by vacuum suction from being deformed by a foreign substance existing between the substrate and the vacuum plate.

21. The single type substrate polishing apparatus of claim 16, wherein the cleaning unit comprises:

a first cleaning unit disposed at a side of the substrate supporting unit for cleaning a top surface of the substrate; and

a second cleaning unit disposed at a top center portion of the supporting plate for supplying a cleaning liquid to a bottom surface of the substrate,

wherein an opening is formed through a center portion of the vacuum plate to allow supply of the cleaning liquid from the second cleaning unit to the bottom surface of the substrate.

22. The single type substrate polishing apparatus of claim 15, wherein the driving member comprises:

an upper magnet member disposed at the supporting plate;

a lower magnet member disposed under the upper magnet member to face the upper magnet member, poles of the lower magnet member being oriented such that a magnetic repulsive force acts between the upper and lower magnet members; and

a linear driving unit configured to move the lower magnet member upward and downward.

23. The single type substrate polishing apparatus of claim 22, wherein the chucking members comprise:

supporting pins configured to support a bottom surface of the substrate; and

L-shaped chucking rods rotatably disposed outside the supporting pins for supporting an edge of the substrate,

wherein holes are formed through the vacuum plate for receiving the supporting pins when the supporting plate is moved upward and downward.

24. The single type substrate polishing apparatus of claim 23, wherein a pressing member protrudes from a bottom surface of the vacuum plate, and

when the supporting plate is moved upward, the pressing member presses horizontal parts of the L-shaped chucking rods to rotate the chucking rods such that vertical parts of the rotated chucking rods support the edge of the substrate.

25. The single type substrate polishing apparatus of claim 22, wherein further comprising a guide member disposed at a rotation shaft supporting the vacuum plate for guiding upward and downward movements of the supporting plate.

26. The single type substrate polishing apparatus of claim 22, further comprising an elastic member configured to exert an elastic repulsive force between the vacuum plate and the supporting plate.

27. The single type substrate polishing apparatus of claim 22, wherein the cleaning unit comprises:

a first cleaning unit disposed at a side of the substrate supporting unit for cleaning a top surface of the substrate; and

a second cleaning unit disposed at the vacuum plate for supplying a cleaning liquid to a bottom surface of the substrate.

28. A method of polishing a substrate using the apparatus of claim 15, the method comprising:

polishing a top surface of a substrate after attaching the substrate to a vacuum plate by vacuum suction;

moving the vacuum plate or a supporting plate upward and downward so as to support the substrate using chucking members of the supporting plate in a state where the substrate is spaced upwardly from the vacuum plate; and

cleaning a bottom surface of the polished substrate supported by the chucking members of the supporting plate.

29. The method of claim 28, wherein the top and bottom surfaces of the polished substrate are simultaneously cleaned.