MANUFACTURING METHOD FOR A WIRELESS COMMUNICATION DEVICE AND MANUFACTURING APPARATUS
First Claim
1. A method of preparing wireless communication chips for later processing, the method comprising:
- positioning a wireless communication chip within a container on a carrier tape;
stripping a protective adhesive from the carrier tape;
passing the carrier tape over a first roller; and
forcing the wireless communication chip into contact with an adhesive tape for later processing.
3 Assignments
0 Petitions
Accused Products
Abstract
A method for manufacturing wireless communication devices for use in tracking or identifying other items comprises a number of cutting techniques that allow the size of the antenna for the wireless communication device. Further, the chip for the wireless communication device is nested so as to be flush with the surface of the substrate of the wireless communication device. Rollers cut the tabs that form the antenna elements. In a first embodiment, a plurality of rollers is used, each on effecting a different cut whose position may be phased so as to shorten or lengthen the antenna element. In a second embodiment, the rollers are independently positionable to shorten or lengthen the antenna element.
59 Citations
16 Claims
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1. A method of preparing wireless communication chips for later processing, the method comprising:
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positioning a wireless communication chip within a container on a carrier tape; stripping a protective adhesive from the carrier tape; passing the carrier tape over a first roller; and forcing the wireless communication chip into contact with an adhesive tape for later processing. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A chip positioning system for preparing wireless communication chips for later processing, wherein the wireless communication chips are fed into the system on a carrier tape comprising a container layer including a plurality of pockets having the wireless communication chips disposed therein and a protective adhesive covering the container layer, the system comprising:
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a waste roller configured to strip the protective adhesive from the carrier tape by wrapping the protective adhesive therearound when rotating such that the wireless communication chips are exposed within the plurality of pockets of the container layer; a first roller configured to pass the carrier tape stripped from the protective adhesive over the first roller; and a second roller configured to rotate proximate to the first roller; wherein the first and second rollers are configured to pass the carrier tape simultaneously with an adhesive tape fed to the system such that the wireless communication chips are forced into contact with the adhesive; and wherein the carrier tape and the adhesive tape are configured to be fed between the first and second rollers. - View Dependent Claims (13, 14, 15, 16)
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Specification