Process for Repairing a Component Comprising a Directional Microstructure by Setting a Temperature Gradient During the Laser Heat Action, and a Component Produced by Such a Process
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Abstract
In one aspect, a repair method for repairing components comprising a base material with a directed microstructure is provided. The repair is performed in such a way that the repaired location correspondingly has a directed microstructure like the surrounding base material. A solder is applied in the region of a location to be repaired and is soldered to the component via heat exposure, a temperature gradient, i.e., for instance a temperature variation from a higher temperature to a lower temperature, is thereby produced in the region of the location to be repaired.
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Citations
47 Claims
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1-27. -27. (canceled)
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28. A method for repairing a component having a base material with a directional microstructure, comprising:
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applying a solder in a region of a location to be repaired, the solder comprises at least one constituent; and applying heat at a soldering temperature so that the solder is soldered to the component, wherein the soldering temperature of the solder is at least 30°
C. lower than a melting temperature of the base material,wherein during applying heat, a temperature gradient in the region of the location to be repaired is set to generate a directional microstructure in the location to be repaired, and wherein the repaired location has the same directional microstructure as the surrounding base material and that the applying heat takes place locally in the region of the location to be repaired. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 46, 47)
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44. The method as claimed in claimed 43, wherein the location to be repaired has a width of between 1 μ
- m and 500 μ
m.
- m and 500 μ
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45. The method as claimed in claimed 43, wherein the location to be repaired has a width of between 400 μ
- m and 600 μ
m in particular around 500μ
.
- m and 600 μ
Specification