LED module having a heat sink

• US 20100001294A1
• Filed: 06/12/2009
• Published: 01/07/2010
• Est. Priority Date: 07/04/2008
• Status: Active Grant

• Current Assignee: Siteco GmbH (Prosperity Lamps & Components Limited)
• Original Assignee: OSRAM GmbH (Ams-Osram AG)
• Inventors: Reuter, Martin, Faller, Alexander, Kaiser, Moritz
• Granted Patent: US 8,754,437 B2
• Time in Patent Office: Days
• US Class Current: 257/79
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/0272 Adaptations for fluid transport, e.g. channels, holes
• CPC Class Codes: H05K 1/053 the metal substrate being covered by an inorganic insulating layer
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2203/025 Abrading, e.g. grinding or sand blasting deburring, rounding, bevelling or smoothing conductor edges H05K2203/0346
• CPC Class Codes: H05K 2203/1344 Spraying small metal particles or droplets of molten metal
• CPC Class Codes: H05K 2203/1366 Spraying coating apparatus for coating printed circuit boards using liquid non-metallic coating compositions H05K3/0091
• CPC Class Codes: H05K 3/382 by special treatment of the metal

Abstract

The invention relates to an LED module (1) comprising at least one light-emitting diode (LED) (3) and at least one heat sink (2) for active cooling, having at least one coolant channel (6) through which a cooling fluid flows.

The dimensions of the at least one coolant channel (6) are selected so that a predominantly laminar flow of the fluid is set up in the at least one coolant channel (5) during operation of the LED module (1).

Claims

1. An LED module (1), comprising at least one light-emitting diode (LED) (3) and at least one heat sink (2) for active cooling having at least one coolant channel (6) through which a cooling fluid flows, characterized in that the dimensions of the at least one coolant channel (6) are selected so that a predominantly laminar flow of the fluid is set up in the at least one coolant channel (5) during operation of the LED module (1).

2. The LED module (1) as claimed in claim 1, characterized in that the at least one coolant channel (6), through which a cooling fluid flows, has a width of between 100 μ

m and 400 μ

m.

3. The LED module (1) as claimed in claim 1 or 2, characterized in that the at least one coolant channel (6), through which a cooling fluid flows, has a height of between 25 μ

m and 175 μ

m.

4. The LED module (1) as claimed in claim 1, characterized in that the at least one coolant channel (6), through which a cooling fluid flows, has a hydraulic diameter of between 70 μ

m and 250 μ

m.

5. The LED module (1) as claimed in claim 1, characterized in that the cooling fluid is a medium that is liquid at room temperature, in particular water.

6. The LED module (1) as claimed in claim 1, characterized in that the at least one LED (3) is arranged directly on the coated or uncoated heat sink (2).

7. The LED module (1) as claimed in claim 1, characterized in that at least one layer (5) and/or coating of an electrically insulating material is arranged between the LED (3) and the heat sink (2).

8. The LED module (1) as claimed in claim 1, characterized in that the electrically insulating layer (15) and/or coating is formed by a metal oxide and/or a ceramic material.

9. The LED module (1) as claimed in claim 1, characterized in that an adhesion promoter layer (14), preferably containing aluminum and/or nickel, is arranged between the electrically insulating layer (15) and the heat sink (2).

10. The LED module (1) as claimed in claim 1, characterized in that at least one layer (5) and/or coating of an electrically conductive material is arranged between the LED (3) and the heat sink (2).

11. The LED module (1) as claimed in claim 10, characterized in that the electrically conductive layer (5) and/or coating is designed in the form of at least one conductor track (5).

12. The LED module (1) as claimed in claim 10 or 11, characterized in that at least one solder layer (16) is arranged between the electrically conductive layer (5) and the LED (3).

13. A method for producing an LED module (1) as claimed in claim 1, characterized in that the surface (11) of the heat sink (2) is roughened in a first step, an adhesion promoter layer (14) is applied onto at least some of the roughened surface (11) in a second step, an electrically insulating layer (15) is applied onto at least some of the adhesion promoter layer (14) in a third step and electrical components (3.

14. The method as claimed in claim 13, characterized in that a solder layer (16) is applied onto at least some of the electrically conductive layer (5) in a fifth step.

15. The method as claimed in claim 13, characterized in that the electrical components (3), are applied by means of a reflow solder process.

16. The method as claimed in claim 13, characterized in that the electrical components (3), are adhesively fastened and contacted by means of bonding.

17. The method as claimed in claim 13, characterized in that at least one of the layers (5, 14, 15, 16) and/or the electrically insulating layer (15) and/or the electrically conductive layer (5) and/or the solder layer (16) is applied by means of a thermal spraying method

18. The LED module (1) as claimed in claim 1, characterized in that the at least one coolant channel (6), through which a cooling fluid flows, has a width of 200 μ

m and 300 μ

m.

19. The LED module (1) as claimed in claim 1 or 18, characterized in that the at least one coolant channel (6), through which a cooling fluid flows, has a height of 50 μ

m and 120 μ

m.

20. The LED module (1) as claimed in claim 5, characterized in that the cooling fluid is water.

21. The method of claim 13 for producing an LED module (1) characterized in that the electrical components (3), are light-emitting diodes (3).

22. The method as claimed in claim 13, characterized in that the electrical components (3) are applied by means of a reflow solder process and the electrical components (3), are adhesively fastened and contacted by means of bonding.