ELECTRONIC DEVICE, ELECTRONIC APPARATUS MOUNTED WITH ELECTRONIC DEVICE, ARTICLE EQUIPPED WITH ELECTRONIC DEVICE AND METHOD OF PRODUCING ELECTRONIC DEVICE

• US 20100001387A1
• Filed: 09/14/2009
• Published: 01/07/2010
• Est. Priority Date: 03/23/2007
• Status: Active Grant

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Kobae, Kenji, Takeuchi, Shuichi, Kira, Hidehiko, Kobayashi, Hiroshi
• Granted Patent: US 7,960,215 B2
• Time in Patent Office: Days
• US Class Current: 257/679
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07728 the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 23/16 Fillings or auxiliary members in containers or encapsulations, e.g. centering rings H01L23/42, H01L23/552 take precedence
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/3135 Double encapsulation or coating and encapsulation

Abstract

An electronic device includes: a base; a conductor pattern formed on the base; and a circuit chip electrically connected to the conductor pattern. The electronic device further includes a reinforcing member which is disposed on the base to surround the circuit chip, whose outer shape is like a ring, and which includes layers stacked in the thickness direction of the base. The lowermost layer of the layers is closest to the base and softer than the layer that is at least one of the remaining layers. The electronic device further includes a sealing member which fills an inside of the reinforcing member while covering the top of the circuit chip, thereby sealing the circuit chip on the base.

Claims

1. An electronic device, comprising:

a base;

a conductor pattern formed on the base;

a circuit chip electrically connected to the conductor pattern;

a reinforcing member which is disposed on the base to surround the circuit chip, whose outer shape is like a ring, and which includes a plurality of layers stacked in a thickness direction of the base, the plurality of layers including a lowermost layer that is closest to the base and softer than at least any one of the remaining layers among the plurality of layers; and

a sealing member which fills an inside of the reinforcing member while covering a top of the circuit chip, thereby sealing the circuit chip on the base.

2. The electronic device according to claim 1, wherein the lowermost layer is made of an elastomer.

3. The electronic device according to claim 1, wherein the electronic device is a RFID tag that causes the conductor pattern to function as a communications antenna and causes the circuit chip to carry out wireless communications via the conductor pattern.

4. An electronic apparatus, comprising:

an electronic device; and

an apparatus main section driven by an operation of the electronic device,

wherein the electronic device comprises;

a base,

a conductor pattern formed on the base,

a circuit chip electrically connected to the conductor pattern,

a reinforcing member which is disposed on the base to surround the circuit chip, whose outer shape is like a ring, and which includes a plurality of layers stacked in a thickness direction of the base, the plurality of layers including a lowermost layer that is closest to the base and softer than at least any one of the remaining layers among the plurality of layers, and

a sealing member which fills an inside of the reinforcing member while covering a top of the circuit chip, thereby sealing the circuit chip on the base.

5. An article, comprising:

an electronic device; and

an object equipped with the electronic device,

wherein the electronic device comprises;

a base,

a conductor pattern formed on the base,

a circuit chip electrically connected to the conductor pattern,

a reinforcing member which is disposed on the base to surround the circuit chip, whose outer shape is like a ring, and which includes a plurality of layers stacked in a thickness direction of the base, the plurality of layers including a lowermost layer that is closest to the base and softer than at least any one of the remaining layers among the plurality of layers, and

a sealing member which fills an inside of the reinforcing member while covering a top of the circuit chip, thereby sealing the circuit chip on the base.

6. A method of producing an electronic device, the method comprising:

connecting a circuit chip to a conductor pattern formed on a base;

applying an adhesive to cover a top of the circuit chip with the adhesive;

disposing a reinforcing member whose outer shape is like a ring and which includes a plurality of layers stacked in a thickness direction of the base, the plurality of layers including a lowermost layer that is closest to the base and softer than at least any one of the remaining layers among the plurality of layers, so that the circuit chip is surrounded by the reinforcing member on the base and an inside of the reinforcing member is filled with the adhesive; and

curing the adhesive thereby sealing the circuit chip on the base with the adhesive and fixing the reinforcing member on the base.