DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

• US 20100002404A1
• Filed: 06/25/2009
• Published: 01/07/2010
• Est. Priority Date: 07/04/2008
• Status: Abandoned Application

• Current Assignee: NEC LCD Technologies Limited (Tianma Microelectronics Company Limited)
• Original Assignee: NEC LCD Technologies Limited (Tianma Microelectronics Company Limited)
• Inventors: FUJITA, Akira, Kondo, Yuji
• Application Number:
  US12/491,453
• Publication Number:
  US 20100002404A1
• Time in Patent Office: Days
• US Class Current: 361/752
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: H05K 1/0271 Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
• CPC Class Codes: H05K 1/0272 Adaptations for fluid transport, e.g. channels, holes
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base

Abstract

A display device includes a glass substrate having a display area and a peripheral area. A drive circuit component is mounted on the glass substrate by thermocompression bonding on the peripheral area, and a stress absorption region is provided within the glass substrate close to the circuit component so as to absorb stress produced by thermal deformation of the circuit component. A method of manufacturing the display device of the present invention includes a step of forming stress absorption region into the glass substrate so as to absorb the stress caused by thermocompression bonding of the the circuit component.

Claims

1. A display device, comprising:

a glass substrate having a display area and a peripheral area;

a drive circuit component mounted on said glass substrate by thermocompression bonding on said peripheral area; and

a stress absorption region provided within said glass substrate close to said circuit component so as to absorb stress produced by thermal deformation of said circuit component.

2. The display device according to claim 1, wherein said stress absorption region is located between said display area and said circuit component so as to extend along a side portion of said circuit component adjacent to said display area.

3. The display device according to claim 1, wherein said stress absorption region is located around two corners of said circuit component disposed nearby said display area so as to extend along each of said two corners in a shape of capital letter “

L”

.

4. The display device according to claim 1, wherein said stress absorption region is located around three sides of said circuit component disposed nearby said display area so as to extend along said three sides in a shape of capital letter “

U”

.

5. The display device according to claim 1, wherein said stress absorption region is located so as to surround said circuit component in a frame shape.

6. The display device according to claim 1, wherein said stress absorption region is located so as to be overlapped with said circuit component in a normal direction of said glass substrate.

7. The display device according to claim 1, wherein said stress absorption region includes a hollow part and aggregation of micro cracks.

8. A method of manufacturing a display device comprising:

forming stress absorption region inside a glass substrate located between a display area and a group of terminal electrodes; and

fixing a circuit component on said group of terminal electrodes by using thermocompression bonding.

9. The method of manufacturing the display device according to claim 8, wherein said stress absorption region is formed by irradiating a laser beam into said glass substrate so as to form a hollow part and aggregation of micro cracks.

10. The method of manufacturing the display device according to claim 9, wherein said stress absorption region is formed at central portion of said glass substrate in a thickness direction thereof.