ILLUMINATING DEVICE AND ANNULAR HEAT-DISSIPATING STRUCTURE THEREOF

• US 20100002453A1
• Filed: 10/28/2008
• Published: 01/07/2010
• Est. Priority Date: 07/04/2008
• Status: Abandoned Application

• Current Assignee: Delta Electronics Incorporated
• Original Assignee: Delta Electronics Incorporated
• Inventors: Hsu, Han-Chung, Yu, Chih-Hao, Chiu, Te-Hsin, WU, Hsiang-Chen, Cheng, Chin-Ming
• Application Number:
  US12/259,601
• Publication Number:
  US 20100002453A1
• Time in Patent Office: Days
• US Class Current: 362/373
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21V 29/677 the fans being used for discharging
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/773 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/80 with pins or wires
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: F21V 3/00 Globes; Bowls; Cover glasses with refracting properties F21V5/00; with reflecting properties F21V7/00; characterised by cooling arrangements F21V29/506
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]

Abstract

An illuminating device and an annular heat-dissipating structure thereof. The annular heat-dissipating structure includes a plurality of heat-dissipating units disposed circumambiently. Each heat-dissipating unit includes a flake and at least one first assembling portion connected with the flake, so that the adjacent heat-dissipating units can be connected with each other.

Claims

1. A heat-dissipating structure comprising:

a plurality of heat-dissipating units, each of which comprises;

a flake; and

at least one first assembling portion connected with the flake for connecting one heat-dissipating unit with the adjacent heat-dissipating unit.

2. The heat-dissipating structure according to claim 1, wherein the heat-dissipating unit further comprises a second assembling portion correspondingly connected to the first assembling portion of the adjacent heat-dissipating unit.

3. The heat-dissipating structure according to claim 2, wherein the first assembling portion is a protrusion, and the second assembling portion is a hole.

4. The heat-dissipating structure according to claim 1, wherein lateral surfaces of the heat-dissipating units form a discontinuous plane, and a heat source is attached on the discontinuous plane.

5. The heat-dissipating structure according to claim 1, wherein the heat-dissipating unit further comprises a bending portion formed by bending one end of the flake, and a heat source is attached on the bending portion.

6. The heat-dissipating structure according to claim 5, wherein an extending direction of a conjunction line between the bending portion and the flake tilts with an angle related to a radial direction of the heat-dissipating structure

7. The heat-dissipating structure according to claim 5, wherein the bending portion is a planar surface or an oblique surface, the bending portion of one heat-dissipating unit is coupled to that of the adjacent heat-dissipating unit to form an annular surface, and the first assembling portion is protruded from the bending portion.

8. The heat-dissipating structure according to claim 5, wherein the width of one end of the bending portion is smaller than that of the other end of the bending portion.

9. The heat-dissipating structure according to any of claims 1, wherein the heat-dissipating structure is circular ring-shaped, elliptic ring-shaped, triangular ring-shaped, rectangular ring-shaped, polygonal ring-shaped, annular cone-shaped, annular pyramid or asymmetric annular pyramid.

10. The heat-dissipating structure according to any of claims 1, further comprising a substrate connected to the heat-dissipating structure.

11. The heat-dissipating structure according to claim 10, wherein the substrate is a polygonal substrate, and the substrate is connected to the heat-dissipating structure by welding.

12. The heat-dissipating structure according to any of claims 1, wherein the heat-dissipating units are connected by laser welding, gluing, adhering or locking, and the heat-dissipating units are made of copper, aluminum, iron, magnesium alloy or a high thermoconductive material.

13. The beat-dissipating structure according to any of claims 1, further comprising an airflow passage disposed at the center of the heat-dissipating structure, wherein the heat-dissipating units are disposed around the airflow passage.

14. An illuminating device, comprising:

a heat-dissipating structure comprising a plurality of heat-dissipating units, wherein each of the heat-dissipating units comprises a flake and at least one assembling portion connected with the flake for connecting one heat-dissipating unit with the adjacent heat-dissipating unit; and

a heat source disposed on the heat-dissipating structure.

15. The illuminating device according to claim 14, wherein the heat source is a light-emitting diode (LED), a laser diode (LD), an organic electro-luminescence device (OELD) or a semiconductor light source.

16. The illuminating device according to claim 14, further comprising a lampshade disposed outside the heat-dissipating structure and the heat source.

17. The illuminating device according to claim 16, wherein the lampshade has one or more openings, and the lampshade is transparent or semiopaque.

18. The illuminating device according to claim 14, further comprising a base, wherein the heat-dissipating structure is fixed on the base.

19. The illuminating device according to claim 18, wherein the base has one or more openings.

20. The illuminating device according to claim 14, further comprising a power connector.

21. The illuminating device according to claim 14, further comprising a fan, wherein the fan and the heat source are disposed at two ends of the heat-dissipating structure, respectively, or disposed inside an airflow passage of the heat-dissipating structure.

22. The illuminating device according to claim 14, further comprising a substrate, wherein the substrate is disposed between the heat source and the heat-dissipating structure, or the substrate and the heat source are disposed at two ends of the heat-dissipating structure, respectively.