Suspension board with circuit and producing method thereof

• US 20100002985A1
• Filed: 06/16/2009
• Published: 01/07/2010
• Est. Priority Date: 07/01/2008
• Status: Active Grant

• Current Assignee: Nitto Denko Corporation
• Original Assignee: Nitto Denko Corporation
• Inventors: Naito, Toshiki, Ishii, Jun, Kanagawa, Hitoki
• Granted Patent: US 7,957,614 B2
• Time in Patent Office: Days
• US Class Current: 385/14
• CPC Class Codes: G02B 6/423 using guiding surfaces for the alignment
• CPC Class Codes: G11B 5/486 with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly
• CPC Class Codes: G11B 5/4866 the arm comprising an optical waveguide, e.g. for thermally-assisted recording
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 1/056 the metal substrate being covered by an organic insulating layer
• CPC Class Codes: H05K 2201/09909 Special local insulating pattern, e.g. as dam around component
• CPC Class Codes: H05K 2203/167 Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49895 Associating parts by use of aligning means [e.g., use of a drift pin or a "fixture"]

Abstract

A suspension board with circuit includes a circuit board containing a metal supporting board, an insulating pattern formed on the metal supporting board, and a conductive pattern formed on the insulating pattern; an optical waveguide disposed on the circuit board; and a positioning portion provided on the circuit board in order to position the optical waveguide with respect to the circuit board.

Claims

1. A suspension board with circuit comprising:

a circuit board comprising a metal supporting board, an insulating pattern formed on the metal supporting board, and a conductive pattern formed on the insulating pattern;

an optical waveguide disposed on the circuit board; and

a positioning portion provided on the circuit board in order to position the optical waveguide with respect to the circuit board.

2. The suspension board with circuit according to claim 1, wherein the conductive pattern and the positioning portion are formed from a conductive layer.

3. The suspension board with circuit according to claim 1, wherein the insulating pattern and the positioning portion are formed from an insulating layer.

4. The suspension board with circuit according to claim 1, wherein the positioning portion is arranged in opposed relation so as to sandwich the optical waveguide and is in contact with each opposite side of the optical waveguide.

5. The suspension board with circuit according to claim 1, wherein a plurality of the positioning portions are arranged at spaced intervals to each other over a direction in which the optical waveguide extends.

6. A method for producing a suspension board with circuit comprising the steps of:

preparing a circuit board comprising a metal supporting board, an insulating pattern formed on the metal supporting board, and a conductive pattern formed on the insulating pattern;

preparing an optical waveguide;

providing the circuit board with a positioning portion for positioning the optical waveguide with the circuit board; and

disposing the optical waveguide on the circuit board while positioning the optical waveguide with respect to the positioning portion.

7. The method for producing a suspension board with circuit according to claim 6, wherein, in the step of preparing the circuit board, the step of forming the conductive pattern on the insulating pattern is conducted simultaneously with the step of providing the positioning portion.

8. The method for producing a suspension board with circuit according to claim 6, wherein, in the step of preparing the circuit board, the step of forming the insulating pattern on the metal supporting board is conducted simultaneously with the step of providing the positioning portion.