Systems and methods for curing deposited material using feedback control

• US 20100003021A1
• Filed: 07/01/2008
• Published: 01/07/2010
• Est. Priority Date: 07/01/2008
• Status: Active Grant

• Current Assignee: Gula Consulting Limited Liability Company (Intellectual Ventures LLC)
• Original Assignee: Weyerhaeuser Company (Weyerhauser)
• Inventors: LEE, DAVID L., HIRAHARA, EDWIN
• Granted Patent: US 8,463,116 B2
• Time in Patent Office: Days
• US Class Current: 392/418
• CPC Class Codes: H05K 1/0269 for visual or optical inspection
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 2203/107 Using laser light
• CPC Class Codes: H05K 2203/163 Monitoring a manufacturing process
• CPC Class Codes: H05K 3/1283 After-treatment of the printed patterns, e.g. sintering or curing methods

Abstract

Methods and systems are provided for optimally curing a deposited curable material film using a light source and feedback system for monitoring the degree of curing using detected optical properties of the film. Operational parameters of the light source (e.g., power) are adjusted by a control system in response to the detected optical properties of the film. The curing system includes at least one light source in optical communication with an uncured material, a detector for monitoring an optical property of the curing material, and a feedback system for controlling the light emitted from the light source in response to the detector.

Claims

1. A method for curing a material, comprising the steps of

(a) providing a substrate having a curable material deposited thereon in an uncured state;

(b) emitting an amount of light from a first light source having one or more light source operational parameters, which impinges on at least a portion of the deposited curable material for initiating curing of the curable material;

(c) monitoring a curing characteristic of the curable material as the portion of the curable material transitions from the uncured state to a cured state; and

(d) varying at least one of the one or more light source operational parameters based on the monitored curing characteristic as the portion of the curable material cures.

2. The method of claim 1, wherein the uncured material is a conductive ink.

3. The method of claim 1, wherein the first light source is selected from the group consisting of a laser, a high-intensity lamp, and a flash lamp.

4. The method of claim 1, wherein emitting an amount of light from a first light source comprises intermittently emitting light at a first duty cycle.

5. The method of claim 1, wherein monitoring a curing characteristic is selected from the group consisting of monitoring light reflected off of the curable material and monitoring light absorbed by the curable material.

6. The method of claim 1, wherein monitoring a curing characteristic includes measuring the curing characteristic and transmitting a signal indicative of the curing characteristic to a control system.

7. The method of claim 1, further comprising the step of controlling an area of the uncured material exposed to the amount of light.

8. The method of claim 7, wherein controlling the area of the uncured material exposed to the amount of light comprises using an X-Y positioner to control a position of the first light source.

9. The method of claim 1, wherein monitoring a curing characteristic comprises a second light source impinging light on the curable material.

10. The method of claim 1, wherein varying at least one or more light source operational parameters comprises at least one action selected from the group consisting of turning the light source on, turning the light source off, changing the duty cycle of the light source from a first duty cycle to a second duty cycle, changing the wavelength of the light source, and changing the power of the light source.

11. The method of claim 1, wherein the curable material is deposited substantially adjacent to a printed electronic material and as the portion of the curable material transitions from the uncured to the cured state, the printed electronic material is not degraded.

12. A curing system, comprising:

a support having a surface for supporting a substrate having a curable material deposited thereon;

a first light source disposed at least in partial optical communication with the support;

a detector for monitoring light that impinges on the curable material; and

a feedback system capable of controlling light emitted from the first light source in response to the detector.

13. The curing system of claim 12, wherein the curable material is a curable conductive ink.

14. The curing system of claim 12, wherein the first light source is selected from the group consisting of a laser, a high-intensity lamp, and a flash lamp.

15. The curing system of claim 12, wherein the detector is a photodetector.

16. The curing system of claim 12, further comprising a second light source at least in partial optical communication with the support and the detector.

17. The curing system of claim 12, further comprising a lens module disposed between the first light source and the support.

18. The curing system of claim 12, further comprising a modulator disposed between the first light source and the support.

19. The curing system of claim 12, further comprising an X-Y positioning device.

20. A method for curing conductive silver ink, comprising the steps of

(a) providing a substrate having a curable silver ink deposited thereon in an uncured state;

(b) emitting an amount of light from a first light source having one or more light source operational parameters, which impinges on at least a portion of the deposited curable silver ink for initiating curing of the curable silver ink;

(c) monitoring the reflectivity of the curable silver ink as the portion of the curable silver ink transitions from the uncured state to a cured state; and

(d) varying at least one of the one or more light source operational parameters based on the monitored reflectivity as the portion of the curable silver ink cures.