TRANSPARENT GAS BARRIER FILM AND METHOD FOR PRODUCING TRANSPARENT GAS BARRIER FILM

• US 20100003482A1
• Filed: 01/25/2008
• Published: 01/07/2010
• Est. Priority Date: 02/06/2007
• Status: Active Grant

• Current Assignee: Konica Minolta Holdings Incorporated (Konica Minolta Inc.)
• Original Assignee: Konica Minolta Holdings Incorporated (Konica Minolta Inc.)
• Inventors: Fukuda, Kazuhiro
• Granted Patent: US 8,846,187 B2
• Time in Patent Office: Days
• US Class Current: 428/218
• CPC Class Codes: C23C 16/30 Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
• CPC Class Codes: Y10T 428/24992 Density or compression of components
• CPC Class Codes: Y10T 428/269 including synthetic resin or polymer layer or component

Abstract

Disclosed is a transparent gas barrier film having good transparency and good gas barrier properties, which exhibits excellent adhesion even after storage under severe environmental conditions, and does not deteriorate even when a large impact is applied thereto. The transparent gas barrier film is characterized by having, on a resin base, at least two layers having different elastic moduluses. The transparent gas barrier film is further characterized in that the elastic modulus difference between adjoining layers is not less than 1 GPa but not more than 20 GPa, and each layer has a thickness of not less than 1 nm but not more than 10 nm.

Claims

1. A transparent gas barrier film comprising a resin substrate having thereon two or more layers having different elastic modulus each other wherein a difference of elastic modulus of adjacent layers is not less than 1 GPa and not more than 20 GPa and a thickness of not less than 1 nm and not more than 10 nm.

2. The transparent gas barrier film of claim 1, wherein the layers having different elastic modulus are layer unit A in which an elastic modulus gradually increase from low elastic modulus layer to high elastic modulus layer from the resin substrate.

3. The transparent gas barrier film of claim 1, wherein the layers having different elastic modulus are layer unit B in which an elastic modulus gradually decrease from high elastic modulus layer to low elastic modulus layer from the resin substrate.

4. The transparent gas barrier film of claim 1, wherein the layers having different elastic modulus are composed of layer unit A in which an elastic modulus gradually increase from low elastic modulus layer to high elastic modulus layer and layer unit B in which an elastic modulus gradually decrease from high elastic modulus layer to low elastic modulus layer, from the resin substrate.

5. The transparent gas barrier film of claim 4, wherein at least two units of composite unit composed of the layer unit A and the layer unit B are layered from the resin substrate.

6. The transparent gas barrier film of claim 4, wherein the unit A is positioned at a resin substrate side.

7. The transparent gas barrier film of claim 1, wherein a layer of maximum elastic modulus among the layers having different elastic modulus is a ceramic layer.

8. The transparent gas barrier film of claim 6, wherein a density ratio Y (=ρ

f/ρ

b) is 1≧

Y>

0.95 and a residual stress of the ceramic layer is not less than 0.01 MPa and not more than 10 MPa, wherein ρ

f is a density of the ceramic layer and ρ

b is a density of a thermal oxide layer or thermal nitride layer formed by thermally oxidation or thermally nitridation of a metal of the base material of the ceramic layer.

9. The transparent gas barrier film of claim 7, wherein the ceramic layer comprises at least one selected from silicon oxide, silicon nitride, silicon oxide nitride and aluminum oxide.

10. A manufacturing method of a transparent gas barrier film, manufacturing the transparent gas barrier film of claim 1, wherein at least one of constitution layer is formed by a plasma CVD method at atmospheric pressure or approximately atmospheric pressure.

11. The manufacturing method of a transparent gas barrier film of claim 10, wherein a plasma output density for forming each of constitution layer is within a range of ±

50% of the average plasma output density for forming each of constitution layer.