INTELLIGENT ORTHOTIC INSOLES

• US 20100004566A1
• Filed: 01/08/2009
• Published: 01/07/2010
• Est. Priority Date: 01/11/2008
• Status: Abandoned Application

• Current Assignee: ES2 LLC
• Original Assignee: Esoles LLC
• Inventors: Son, Jae, Ables, David, Hinshaw, Glen D.
• Application Number:
  US12/350,605
• Publication Number:
  US 20100004566A1
• Time in Patent Office: Days
• US Class Current: 600/592
• CPC Class Codes: A43B 17/00 Insoles for insertion, e.g. footbeds or inlays, for attachment to the shoe after the upper has been joined
• CPC Class Codes: A43B 3/34 with electrical or electronic arrangements
• CPC Class Codes: A43B 3/44 with sensors, e.g. for detecting contact or position
• CPC Class Codes: A43B 7/28 Adapting the inner sole or the side of the upper of the shoe to the sole of the foot
• CPC Class Codes: A43D 1/02 Foot-measuring devices measuring the shape, pattern or size of the body for diagnostic purposes A61B5/103, e.g. measuring physical dimensions A61B5/107
• CPC Class Codes: A61B 2562/0247 Pressure sensors
• CPC Class Codes: A61B 2562/046 in a matrix array
• CPC Class Codes: A61B 5/0002 Remote monitoring of patients using telemetry, e.g. transmission of vital signals via a communication network A61B5/07 takes precedence; transmission systems for measured values G08C; transmission H04B; transmission of digital information H04L; wireless communication networks H04W
• CPC Class Codes: A61B 5/1036 Measuring load distribution, e.g. podologic studies

Abstract

An intelligent insole for generating time sensitive information about the pressure on the foot. The insole includes a custom-made, semi-custom or generically sized orthotic component. The orthotic is laminated with a top cover and an intermediate pressure sensor having an array of capacitive pressure sensors. Signal processing equipment may be embedded in the insole or placed locally with the insole as on the side of a shoe. The processor also can connect to a wireless transmitter for relaying the information to a remote site.

Claims

1. An intelligent orthotic insole for insertion into an individual'"'"'s shoe for broadcasting output signals that represent the pressure exerted by the individual'"'"'s foot on said insole, said insole comprising:

A) an integral structure including;

i) a lower portion for engaging the shoe surface and defining a orthotic for the individual, and

ii) sensor pad means affixed to said lower portion for generating an array of signals containing information about the magnitude and position of pressure thereon,

B) a processor responsive to signals from said sensor pad means for generating corresponding output signals, and

C) means attached to said processor for transmitting the output signals to a remote location.

2. The intelligent orthotic insole as recited in claim 1 wherein said sensor pad means comprises a capacitive force sensing matrix that produces a three-dimensional pressure map of the forces acting on the insole.

3. The intelligent orthotic insole as recited in claim 2 wherein said capacitive force sensing matrix includes a compressible dielectric material.

4. The intelligent orthotic insole as recited in claim 2 wherein said sensor pad means is formed as a flexible tactile sensor.

5. The intelligent orthotic insole as recited in claim 2 wherein said sensor pad means comprises an embedded capacitive pressure sensor array.

6. The intelligent orthotic insole as recited in claim 2 wherein the sensor pad means comprises embedded discrete capacitive pressure sensors.

7. The intelligent orthotic insole as recited in claim 2 wherein said force sensing matrix comprises up to 200 pressure sensing locations.

8. The intelligent orthotic insole as recited in claim 2 wherein said force sensing matrix comprises between 3 and 20 pressure sensing locations.

9. The intelligent orthotic insole as recited in claim 2 wherein said processor converts the signals from the sensor pad means into additional time-stamped data packets.

10. The intelligent orthotic insole as recited in claim 2 wherein said processor is embedded in said integral structure.

11. The intelligent orthotic insole as recited in claim 10 wherein said transmitting means is embedded in said integral structure.

12. The intelligent orthotic insole as recited n claim 2 additionally comprising an integral cover overlying was lower portion and said sensor pad means.

13. An intelligent orthotic insole for providing time sensitive information about pressure on the foot comprising:

A) an integral insole structure including;

i) a lower portion for engaging the shoe surface and defining a orthotic for the individual,

ii) a cover substantially coextensive with the lower portion,

iii) sensor pad means attached to said lower portion and integral therewith for generating an array of signals containing information about the magnitude and position of pressure thereon,

B) a processor responsive to signals from said sensor pad means for generating corresponding output signals,

C) means attached to said processor for transmitting the wireless output signals, and

D) receiving means at a remote location for receiving the wireless output signals and displaying the results thereof.

14. The intelligent orthotic insole as recited in claim 13 wherein said receiving means comprises:

i) an antenna,

ii) a receiver for the wireless output signals,

iii) a display, and

iv) a processor for converting the received wireless output signals from the receiver into a display of the pressure exerted on the orthotic insole.

15. The intelligent orthotic insole as recited in claim 14 wherein said sensor pad means comprises a capacitive force sensing matrix that produces a three-dimensional pressure map of the forces acting on the insole.

16. The intelligent orthotic insole as recited in claim 14 wherein said capacitive force sensing matrix includes a compressible dielectric material.

17. The intelligent orthotic insole as recited in claim 14 wherein said sensor pad means is formed as a flexible tactile sensor.

18. The intelligent orthotic insole as recited in claim 14 wherein said sensor pad means comprises an embedded capacitive pressure sensor array.

19. The intelligent orthotic insole as recited in claim 14 wherein the sensor pad means comprises embedded discrete capacitive pressure sensors.

20. The intelligent orthotic insole as recited in claim 14 wherein said processor converts the signals from the sensor pad means into additional time-stamped data packets.