PACKAGE OF MEMS DEVICE AND METHOD FOR FABRICATING THE SAME
First Claim
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1. A package of a micro-electro-mechanical systems (MEMS) device, the package comprising:
- a cap wafer;
a plurality of bonding bumps formed over the cap wafer;
a plurality of array pads arrayed on an outer side of the bonding bumps; and
an MEMS device wafer bonded to an upper portion of the cap wafer in a manner to expose the array pads.
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Abstract
A package of a micro-electro-mechanical systems (MEMS) device includes a cap wafer, a plurality of bonding bumps formed over the cap wafer, a plurality of array pads arrayed on an outer side of the bonding bumps, and an MEMS device wafer bonded to an upper portion of the cap wafer in a manner to expose the array pads.
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Citations
19 Claims
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1. A package of a micro-electro-mechanical systems (MEMS) device, the package comprising:
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a cap wafer; a plurality of bonding bumps formed over the cap wafer; a plurality of array pads arrayed on an outer side of the bonding bumps; and an MEMS device wafer bonded to an upper portion of the cap wafer in a manner to expose the array pads. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification