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PACKAGE OF MEMS DEVICE AND METHOD FOR FABRICATING THE SAME

  • US 20100006959A1
  • Filed: 09/22/2009
  • Published: 01/14/2010
  • Est. Priority Date: 06/14/2006
  • Status: Active Grant
First Claim
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1. A package of a micro-electro-mechanical systems (MEMS) device, the package comprising:

  • a cap wafer;

    a plurality of bonding bumps formed over the cap wafer;

    a plurality of array pads arrayed on an outer side of the bonding bumps; and

    an MEMS device wafer bonded to an upper portion of the cap wafer in a manner to expose the array pads.

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