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DEVICE INCLUDING AN IMIDE LAYER WITH NON-CONTACT OPENINGS AND METHOD

  • US 20100007028A1
  • Filed: 07/11/2008
  • Published: 01/14/2010
  • Est. Priority Date: 07/11/2008
  • Status: Abandoned Application
First Claim
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1. A device comprising:

  • a substrate;

    a metallization layer on a main surface of the substrate;

    an imide layer on the metallization layer;

    at least one contact opening through the imide layer; and

    a plurality of non-contact openings in the imide layer, the non-contact openings being dimensioned to provide for an increased surface area of the imide layer or a surface area of the imide layer which is not reduced by more than 10 percent.

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