METHOD FOR FORMING SOLDER LAYER ON PRINTED-WIRING BOARD AND SLURRY DISCHARGE DEVICE

• US 20100009070A1
• Filed: 10/12/2007
• Published: 01/14/2010
• Est. Priority Date: 10/17/2006
• Status: Abandoned Application

• Current Assignee: Showa Denko KK
• Original Assignee: Showa Denko KK
• Inventors: Shoji, Takashi, Sakai, Takekazu
• Application Number:
  US12/445,379
• Publication Number:
  US 20100009070A1
• Time in Patent Office: Days
• US Class Current: 427/98.600
• CPC Class Codes: B23K 2101/42 Printed circuits
• CPC Class Codes: B23K 3/0638 for viscous material feeding, e.g. solder paste feeding B23K3/0623 takes precedence
• CPC Class Codes: H05K 2203/0126 Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
• CPC Class Codes: H05K 2203/124 Heterocyclic organic compounds, e.g. azole, furan
• CPC Class Codes: H05K 3/3485 Applying solder paste, slurry or powder thick film methods for applying conductive paste or ink patterns H05K3/12

Abstract

A method for forming a solder layer on the surface of a conductive circuit on a printed-wiring board includes discharging slurry containing solder powder onto the surface and heating the substrate. The slurry is discharged by dint of the pressure in a tank for the slurry. In a discharging device to be used in the method, the tank for storing the slurry is provided with a discharge pipe (2) for the slurry and a delivery pipe (1) for gas or solvent to be used for adjusting the pressure in the tank. In this device, one common pipe may be used both for discharging the slurry from the tank and delivering the slurry to the tank and one common pipe may be used for both delivering gas into the tank and sucking the gas from the tank.

Claims

1. A method for forming a solder layer on a surface of a conductive circuit on a printed-wiring board, comprising causing slurry containing solder power to be discharged from inside a tank onto the surface of the conductive circuit utilizing a pressure generated in the tank, allowing the solder powder to adhere to the surface of the conductive circuit and heating the adhered slurry.

2. A method for forming a solder layer according to claim 1, wherein the slurry is discharged in a liquid in which the printed-wiring board has been immersed.

3. A method for forming a solder layer according to claim 1, further comprising causing a gas or a solvent to be forced in or out of the tank, thereby adjusting the pressure in the tank for the slurry.

4. A device for discharging slurry containing solder powder, which is used for a method for forming a soldered circuit on a surface of a conductive circuit on a printed-wiring board comprising imparting tackiness to the surface, discharging the slurry containing solder powder to a resultant tacky part, thereby allowing adhesion of the solder powder thereto, and then heating the printed-wiring board, thereby fusing the solder, and which comprises a tank that stores the slurry and is provided with a discharge pipe for the slurry and a delivery pipe for gas or solvent used for adjusting a pressure in the tank.

5. A device for discharging slurry according to claim 4, wherein the delivery pipe for gas or solvent is provided with at least one of a pump and a switch valve.

6. A device for discharging slurry containing solder powder, which is used for a method for forming a soldered circuit on a surface of a conductive circuit on a printed-wiring board comprising imparting tackiness to the surface, discharging the slurry containing solder powder to a resultant tacky part, thereby allowing adhesion of the solder powder thereto, and then heating the printed-wiring board, thereby fusing the solder, and which comprises a tank for storing the slurry, a slurry discharge and suction pipe disposed in the tank, a suction pipe for gas or solvent used for storing the slurry in the tank, and a delivery pipe for gas or solvent to be used for releasing the slurry stored in the tank via the slurry discharge and suction pipe.

7. A device for discharging a slurry according to claim 6, wherein the suction pipe and the delivery pump for gas or solvent are provided with at least one of a pump and a switch valve.

8. A device for discharging a slurry containing solder powder, which is used for a method for forming a soldered circuit on a surface of a conductive circuit on a printed-wiring board comprising imparting tackiness to the surface, discharging the slurry containing solder powder to a resultant tacky part, thereby allowing adhesion of the solder powder thereto, and then heating the printed-wiring board, thereby fusing the solder, and which comprises a tank for storing the slurry, a slurry discharge and suction pipe disposed in the tank, and a switching delivery pipe for gas or solvent to be used for suction of the slurry for storing the slurry in the tank and release of the slurry stored in the tank via the slurry discharge and suction pipe, the switching delivery pipe for gas or solvent being provided in a lower part of a position seating the tank with a filter for allowing no passage of the solder powder.

9. A device for discharging a slurry containing solder powder according to claim 8, wherein the switching delivery pipe for gas or solvent is provided with at least one of a pump capable of sucking and feeding gas or solvent and a switch valve.