METHOD FOR THE PRODUCING STRUCTURED ELECTRICALLY CONDUCTIVE SURFACES

• US 20100009094A1
• Filed: 01/17/2008
• Published: 01/14/2010
• Est. Priority Date: 01/19/2007
• Status: Abandoned Application

• Current Assignee: BASF SE
• Original Assignee: BASF SE Patents Trademarks and Licenses (BASF SE)
• Inventors: Kaczun, Jürgen, Wagner, Norbert, Pfister, Jürgen, Lochtman, Rene
• Application Number:
  US12/523,672
• Publication Number:
  US 20100009094A1
• Time in Patent Office: Days
• US Class Current: 427/555
• CPC Class Codes: H05K 1/092 Dispersed materials, e.g. conductive pastes or inks
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 2201/0112 Absorbing light, e.g. dielectric layer with carbon filler for laser processing
• CPC Class Codes: H05K 2201/0347 Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
• CPC Class Codes: H05K 2203/107 Using laser light
• CPC Class Codes: H05K 3/027 the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
• CPC Class Codes: H05K 3/185 by making a catalytic pattern by photo-imaging
• CPC Class Codes: H05K 3/246 Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating

Abstract

Method for producing structured electrically conductive surfaces on a substrate, which comprises the following steps:

• a) structuring a base layer containing electrolessly and/or electrolytically coatable particles on the substrate by ablating the base layer according to a predetermined structure with a laser,
• b) activating the surface of the electrolessly and/or electrolytically coatable particles and
• c) applying an electrically conductive coating onto the structured base layer.

Claims

1. A method for producing structured electrically conductive surfaces on a substrate, which comprises the following steps:

a) structuring a base layer containing electrolessly and/or electrolytically coatable particles on the substrate by ablating the base layer according to a predetermined structure with a laser, wherein the electrolessly and/or electrolytically coatable particles are provided with a coating, which reflects the laser light only weakly or consists of a material which reflects the laser light only weakly,

b) activating the surface of the electrolessly and/or electrolytically coatable particles and

c) applying an electrically conductive coating onto the structured base layer.

2. The method as claimed in claim 1, wherein a dispersion, which contains the electrolessly and/or electrolytically coatable particles, is applied onto the substrate in order to form the base layer before the ablation of the base layer by the laser.

3. The method as claimed in claim 2, wherein the application of the dispersion in order to form the base layer is carried out by a printing, casting, rolling, immersion or spray method.

4. The method as claimed in claim 2, wherein the dispersion is stirred and/or pumped around and/or thermally regulated in a storage container before application.

5. The method as claimed in claim 1, wherein the dispersion applied onto the substrate is at least partially dried and/or cured.

6. The method as claimed in claim 5, wherein the at least partial drying or curing of the dispersion is carried out before the ablation with the laser or after the ablation with the laser.

7. The method as claimed in claim 1, wherein the laser is a solid state laser, a fiber laser, a diode laser, a gas laser or an excimer laser.

8. The method as claimed in claim 1, wherein the wavelength of the laser light lies in the range between 150 and 10600 nm, preferably in the range between 600 and 10600 nm.

9. The method as claimed in claim 1, wherein the electrolessly and/or electrolytically coatable particles contain at least one metal powder, carbon or a mixture thereof.

10. The method as claimed in claim 9, wherein the metal of the metal powder is selected from iron, nickel, silver, tin, zinc or copper.

11. The method as claimed in claim 9, wherein the metal powder is a carbonyl-iron powder.

12. The method as claimed in claim 2, wherein the dispersion contains an absorbent for laser light.

13. The method as claimed in claim 12, wherein the absorbent is carbon or lanthanum hexaboride.

14. The method as claimed in claim 1, wherein the electrolessly and/or electrolytically coatable particles have different particle geometries.

15. The method as claimed in claim 1, wherein the electrolessly and/or electrolytically coatable particles contained in the dispersion are chemically, physically or mechanically exposed before the electroless and/or electrolytic coating.

16. The method as claimed in claim 1, wherein any existing coating is removed from the electrolessly and/or electrolytically coatable particles in order to activate the surface of the electrolessly and/or electrolytically coatable particles.

17. The method as claimed in claim 2, wherein the substrate is cleaned by a dry method, a wet chemical method and/or a mechanical method before the application of the dispersion which contains the electrolessly and/or electrolytically coatable particles.

18. The method as claimed in claim 1, wherein a structured electrically conductive surface is applied onto the upper side and the lower side of the support.

19. The method as claimed in claim 18, wherein the structured electrically conductive surfaces on the upper side and the lower side of the support are connected together by via contacting.

20. The method as claimed in claim 1, wherein the electrically conductive coating is applied electrolessly and/or electrolytically onto the base layer.

21. The method as claimed in claim 20, wherein the base layer is connected for the electrolytic coating to auxiliary contacting lines which are contacted by at least one cathode.

22. The method as claimed in claim 1 for producing conductor tracks on printed circuit boards, RFID antennas, transponder antennas or other antenna structures, chip card modules, flat cables, seat heaters, foil conductors, conductor tracks in solar cells or in LCD/plasma screens, 3D molded interconnected devices, integrated circuits, resistive, capacitive or inductive elements, diodes, transistors, sensors, actuators, optical components, receiver/transmission devices, decorative or functional surfaces on products, which are used for shielding electromagnetic radiation, for thermal conduction or as packaging, thin metal foils or polymer supports clad on one or two sides, or for producing electrolytically coated products in any form.